Classical hydrodynamic lubrication theory has been one of the most successful and widely used theories in all of engineering and applied science. This theory predicts that the force resisting the squeezing of a fluid between two parallel plates is inversely proportional to the cube of the fluid thickness. However, recent reports on liquid squeeze film damping in microsystems appear to indicate that experimentally measured damping force is proportional to the inverse of the fluid thickness to the first power—a large fundamental discrepancy from classical theory. This paper investigates potential limitations of lubrication theory in microsystems by theoretical and computational methods. The governing equations for a Newtonian incompressible fluid are solved subject to two-dimensional, parallel surface squeezing by an open-source computational fluid dynamics program called parallel hierarchic adaptive stabilized transient analysis (PHASTA), and by a classical similarity solution technique. At low convective Reynolds numbers, the damping force is determined as a function of the ratio of a reference film thickness to a reference direction along the film. Good agreement with classical lubrication theory is found for aspect ratios as high as 1 despite the fact that lubrication theory requires that this ratio be “small.” A similarity analysis shows that when instantaneous convective Reynolds number is of order 10–100 (a range present in experiment), calculated damping deviates significantly from lubrication theory. This suggests that nonlinearity associated with high Reynolds numbers could explain the experimentally observed discrepancy in damping force. Dynamic analysis of beams undergoing small vibrations in the presence of a liquid medium further supports this finding.
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July 2010
Research Papers
On Squeeze Film Damping in Microsystems
Victor Marrero,
Victor Marrero
Graduate Student
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
ci, Troy, NY 12180-3590
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Diana-Andra Borca-Tasciuc,
Diana-Andra Borca-Tasciuc
Assistant Professor
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
ci, Troy, NY 12180-3590
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John Tichy
John Tichy
Professor
Department of Mechanical, Aerospace, and Nuclear Engineering,
e-mail: tichyj@rpi.edu
Rensselaer Polytechnic Institute
ci, Troy, NY 12180-3590
Search for other works by this author on:
Victor Marrero
Graduate Student
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
ci, Troy, NY 12180-3590
Diana-Andra Borca-Tasciuc
Assistant Professor
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
ci, Troy, NY 12180-3590
John Tichy
Professor
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
ci, Troy, NY 12180-3590e-mail: tichyj@rpi.edu
J. Tribol. Jul 2010, 132(3): 031701 (6 pages)
Published Online: June 4, 2010
Article history
Received:
May 6, 2009
Revised:
April 9, 2010
Online:
June 4, 2010
Published:
June 4, 2010
Citation
Marrero, V., Borca-Tasciuc, D., and Tichy, J. (June 4, 2010). "On Squeeze Film Damping in Microsystems." ASME. J. Tribol. July 2010; 132(3): 031701. https://doi.org/10.1115/1.4001620
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