Tribological properties are crucial to the reliability of microelectromechanical systems/nanoelectromechanical systems (MEMS/NEMS). In this study, adhesion and friction measurements are made at micro and nanoscales on single-crystal silicon (commonly used in MEMS/NEMS) and hydrophobic and low friction films. These include diamondlike carbon (DLC), chemically bonded perfluoropolyether (PFPE), and self-assembled monolayer (SAM) films. Since MEMS/NEMS devices are expected to be used in various environments, measurements are made at a range of velocities, humidities, and temperatures. The relevant adhesion and friction mechanisms are discussed. It is found that solid films of DLC, PFPE, and SAM can reduce the adhesion and friction of silicon. These films can be used as anti-adhesion films for MEMS/NEMS components under different environments and operating conditions. Finally, the adhesion and friction data clearly show scale dependence. The scale effects on adhesion and friction are also discussed in the paper.
Adhesion and Friction Studies of Silicon and Hydrophobic and Low Friction Films and Investigation of Scale Effects
Contributed by the Tribology Division for publication in the ASME JOURNAL OF TRIBOLOGY. Manuscript received by the Tribology Division August 6, 2003; revised manuscript received October 17, 2003. Associate Editor: J. A. Tichy.
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Bhushan, B., Liu, H., and Hsu, S. M. (June 28, 2004). "Adhesion and Friction Studies of Silicon and Hydrophobic and Low Friction Films and Investigation of Scale Effects ." ASME. J. Tribol. July 2004; 126(3): 583–590. https://doi.org/10.1115/1.1739407
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