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1-6 of 6
Keywords: liquid cooling
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2021, 13(3): 034501.
Paper No: TSEA-20-1251
Published Online: September 18, 2020
... will be significantly decreased if the heat released by the electronic chips can be reduced directly. Although liquid cooling heat sinks (LCHS) have been demonstrated as an effective way to resolve this problem, the application of LCHS is limited by the uneven cooling distribution on the surface of the electronic chips...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2021, 13(2): 021015.
Paper No: TSEA-20-1237
Published Online: August 5, 2020
... system (BTMS) is essential for an EV. This article has conducted a comprehensive study on liquid-cooled BTMS. Two cooling schemes are designed: the serpentine channel and the U-shaped channel. The results show that the cooling effect of two schemes is roughly the same, but the U-shaped channel can...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2020, 12(5): 051006.
Paper No: TSEA-19-1504
Published Online: February 26, 2020
...Zhiguo Tang; Qin Gao; Jie Li; Jianping Cheng Battery thermal management (BTM) has an important significance for electronic vehicles to keep them operating in a reasonable temperature range and reduce local temperature differences. In this study, a novel structure of liquid cooling-based lithium-ion...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2019, 11(3): 034501.
Paper No: TSEA-17-1462
Published Online: January 29, 2019
...Özgür Atik; Hakan Ertürk Cooling performance enhancement of computer liquid cooling (LC) systems using hexagonal boron nitride (hBN)–water nanofluids is investigated experimentally. Particle volume fractions of 0.1–2% are considered at constant flow rates varying from 0.3 to 2 L/min for two...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031004.
Paper No: TSEA-12-1033
Published Online: June 24, 2013
... electronic module via a jet impingement scheme utilizing microfinned surfaces. jet impingement liquid cooling microstructured surfaces power electronics Efforts to decrease the size, weight, and cost of automotive power electronics systems drive the need for more efficient cooling schemes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011004.
Paper No: TSEA-12-1029
Published Online: February 22, 2013
... . 10.1007/s00231-011-0795-7 [11] Wei , X. , Joshi , Y. , and Patterson , M. K. , 2007 , “ Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices ,” ASME J. Heat Transfer , 129 , pp. 1432 – 1444 . 10.1115/1.2754781 [12...