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Journal Articles

Nanoliquid Jet Impingement Heat Transfer for a Phase Change Material Embedded Radial Heating System

Fatih Selimefendigil, Hakan F. Öztop
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071002.
Paper No: TSEA-21-1161
DOI: https://doi.org/10.1115/1.4052351
Published Online: October 13, 2021
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Topics: Finite element methods, Heat transfer, Heating, Phase change materials, Reynolds number, Water, Fluids, Nanoparticles, Plates (structures), Temperature
Journal Articles

Thermal Characterization of Building Walls Under Random Boundary Conditions

Emilio Sassine, Yassine Cherif, Emmanuel Antczak, Joseph Dgheim
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. October 2021, 13(5): 054502.
Paper No: TSEA-20-1469
DOI: https://doi.org/10.1115/1.4049432
Published Online: March 10, 2021
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Topics: Boundary-value problems, Heat capacity, Heat flux, Heat transfer, Numerical analysis, Temperature, Thermal characterization, Thermal conductivity, Finite element methods, Heat
Journal Articles

Phase Change Material Melting in an Energy Storage Module for a Micro Environmental Control System

Mustafa Koz, H. Ezzat Khalifa
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2018, 10(6): 061010.
Paper No: TSEA-18-1107
DOI: https://doi.org/10.1115/1.4040896
Published Online: August 20, 2018
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Topics: Air flow, Control systems, Cooling, Finite element model, Melting, Phase change materials, Slabs, Temperature, Storage, Finite element methods
Journal Articles

Enhanced Cooling of Electronic Components Using Fluid Flow Under High Adverse Pressure Gradient

S. Ravishankar, K. Arul Prakash
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2015, 7(3): 031011.
Paper No: TSEA-13-1036
DOI: https://doi.org/10.1115/1.4026004
Published Online: September 1, 2015
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Topics: Cooling, Electronic components, Flow (Dynamics), Fluid dynamics, Heat transfer, Pressure gradient, Pressure drop, Finite element methods, Vortices, Printed circuit boards