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Review Article

J. Thermal Sci. Eng. Appl. July 2022, 14(7): 070801. doi: https://doi.org/10.1115/1.4052593

Research Papers

J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071001. doi: https://doi.org/10.1115/1.4052347
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071002. doi: https://doi.org/10.1115/1.4052351
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071003. doi: https://doi.org/10.1115/1.4052352
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071004. doi: https://doi.org/10.1115/1.4052349
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071005. doi: https://doi.org/10.1115/1.4052350
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071006. doi: https://doi.org/10.1115/1.4052378
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071007. doi: https://doi.org/10.1115/1.4052453
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071008. doi: https://doi.org/10.1115/1.4052455
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071009. doi: https://doi.org/10.1115/1.4052691
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071010. doi: https://doi.org/10.1115/1.4052693
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071011. doi: https://doi.org/10.1115/1.4053017
J. Thermal Sci. Eng. Appl. July 2022, 14(7): 071012. doi: https://doi.org/10.1115/1.4052985

Technical Brief

J. Thermal Sci. Eng. Appl. July 2022, 14(7): 074501. doi: https://doi.org/10.1115/1.4052454
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