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J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081001. doi: https://doi.org/10.1115/1.4052987
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081002. doi: https://doi.org/10.1115/1.4053016
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081003. doi: https://doi.org/10.1115/1.4052986
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081004. doi: https://doi.org/10.1115/1.4053054
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081005. doi: https://doi.org/10.1115/1.4053337
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081006. doi: https://doi.org/10.1115/1.4053055
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081007. doi: https://doi.org/10.1115/1.4053056
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081008. doi: https://doi.org/10.1115/1.4053119
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081009. doi: https://doi.org/10.1115/1.4053120
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081010. doi: https://doi.org/10.1115/1.4053169
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081011. doi: https://doi.org/10.1115/1.4053170
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081012. doi: https://doi.org/10.1115/1.4053171

Technical Brief

J. Thermal Sci. Eng. Appl. August 2022, 14(8): 084501. doi: https://doi.org/10.1115/1.4053118
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