Liquid metal owns the highest thermal conductivity among all the currently available fluid materials. This property enables it to be a powerful coolant for the thermal management of large power device or high flux chip. In this paper, a high-efficiency heat dissipation system based on the electromagnetic-driven rotational flow of liquid metal was demonstrated. The velocity distribution of the liquid metal was theoretically analyzed and numerically simulated. The results showed that the velocity was distributed unevenly along longitudinal section and the maximum velocity appears near the anode. On the temperature distribution profile of the heat dissipation system, the temperature on the electric heater side was much higher than the other regions and the role of the rotated liquid metal was to homogenize the temperature of the system. To analyze the heat dissipation of the system performance, a second-order R-C network thermal resistance model of the experimental device was established with the parameters determined. The total thermal resistance of the dissipation system presented an increasing tendency with the increase of the heating power and gradually stabilized to about 4.42 °C/W. Besides, the relationship between the temperature of the electric heater and the heating power was experimentally determined. And it exhibits linear characteristic with the slope value of about 1.033 oC/W. With such corresponding relations, the heating power could be conveniently determined once the maximum control temperature was given. The heat dissipation method introduced in the paper provides a novel way for fabricating compact chip cooling system.