This paper presents an integrated power electronics module with a vapor chamber (VC) acting as a heat spreader to transfer the heat from the insulated gate bipolar transistor (IGBT) module to the base of the heat-sink. The novel VC integrated in a power module instead of a metal substrate is proposed. Compared with a conventional metal heat spreader, the VC significantly diffuses the concentrated heat source to a larger condensing area. The experimental results indicate that the VC based heat-sink will maintain the IGBT junction temperature cooler than a non-VC based heat-sink with high power density. The junction-to-case thermal resistance of the power module based on the VC is about 50% less than that of the power module based on a copper substrate with the same weight. The chip overshooting temperature of the copper substrate module with the same weight goes beyond against the junction temperature of the VC module at a given impulse power of 225 W. Consequently, thanks to a longer time duration to reach the same temperature, a power surge for the chip can be avoided and the ability to resist thermal impact during the VC module startup can be improved as well. The investigation shows that the VC power module is an excellent candidate for the original metal substrate, especially for an integrated power module with high power density.
Skip Nav Destination
Article navigation
June 2009
Research Papers
Vapor Chamber Acting as a Heat Spreader for Power Module Cooling
Y. P. Zhang,
Y. P. Zhang
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi'an, Shaanxi 710049, China; School of Energy, Xi’an University of Science and Technology
, Xi’an 710054, China
Search for other works by this author on:
X. L. Yu,
X. L. Yu
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi’an, Shaanxi 710049, China
Search for other works by this author on:
Q. K. Feng,
Q. K. Feng
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi’an, Shaanxi 710049, China
Search for other works by this author on:
L. H. Zhang
L. H. Zhang
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi’an, Shaanxi 710049, China
Search for other works by this author on:
Y. P. Zhang
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi'an, Shaanxi 710049, China; School of Energy, Xi’an University of Science and Technology
, Xi’an 710054, China
X. L. Yu
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi’an, Shaanxi 710049, China
Q. K. Feng
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi’an, Shaanxi 710049, China
L. H. Zhang
School of Energy and Power Engineering,
Xi’an Jiaotong University
, Xi’an, Shaanxi 710049, ChinaJ. Thermal Sci. Eng. Appl. Jun 2009, 1(2): 021003 (8 pages)
Published Online: November 4, 2009
Article history
Received:
November 27, 2008
Revised:
September 7, 2009
Online:
November 4, 2009
Published:
November 4, 2009
Citation
Zhang, Y. P., Yu, X. L., Feng, Q. K., and Zhang, L. H. (November 4, 2009). "Vapor Chamber Acting as a Heat Spreader for Power Module Cooling." ASME. J. Thermal Sci. Eng. Appl. June 2009; 1(2): 021003. https://doi.org/10.1115/1.4000285
Download citation file:
Get Email Alerts
Cited By
Design Optimization of a Shell-and-Tube Heat Exchanger based on Variable Baffle Cuts and Sizing
J. Thermal Sci. Eng. Appl
Related Articles
Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
J. Electron. Packag (March,2011)
Thermal Interfacing Techniques for Electronic Equipment—A Perspective
J. Electron. Packag (June,2003)
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
J. Electron. Packag (September,2003)
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
J. Electron. Packag (September,2000)
Related Proceedings Papers
Related Chapters
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Resistance Mythology
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong