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Proceedings Papers

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Zhengfang Qian, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 377-382, November 16–21, 1997

Paper No: IMECE1997-1113

DOI: https://doi.org/10.1115/IMECE1997-1113

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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects

Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997

Paper No: IMECE1997-1234

DOI: https://doi.org/10.1115/IMECE1997-1234

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Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film

Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

On the Life Prediction and Accelerated Testing of Solder Joints

Zhengfang Qian, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 1-11, November 15–20, 1998

Paper No: IMECE1998-0422

DOI: https://doi.org/10.1115/IMECE1998-0422

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Topics: Solder joints, Testing, Fatigue life, Flip-chip packages, Constitutive equations, Finite element analysis, Finite element model, Modeling, Solders, Temperature

Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998

Paper No: IMECE1998-0426

DOI: https://doi.org/10.1115/IMECE1998-0426

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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination

Proceedings Papers

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Minfu Lu, Zhengfang Qian, Sheng Liu, Jianhau Wu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 43-49, November 15–20, 1998

Paper No: IMECE1998-0427

DOI: https://doi.org/10.1115/IMECE1998-0427

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Topics: Fatigue testing, Linear motors, Solder joints, Fatigue, Damage, Engines, Motors, Solders, Failure, Fracture (Materials)

Proceedings Papers

Seamless Tool Integration for Solder Joint Qualifications

Zhengfang Qian, Xin Wu

Proc. ASME. IMECE2008, Volume 12: Mechanics of Solids, Structures and Fluids, 187-193, October 31–November 6, 2008

Paper No: IMECE2008-66449

DOI: https://doi.org/10.1115/IMECE2008-66449

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Topics: Solder joints, Reliability, Electronic components, Failure, Geometry, Printed circuit boards, Boundary-value problems, Computer software, Constitutive equations, Electronic packages

Proceedings Papers

Deterministic and Statistical Reliability of Surface Mount Components

Zhengfang Qian, Xiaohua Wu, Joe Tomase

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 151-158, November 17–22, 2002

Paper No: IMECE2002-39633

DOI: https://doi.org/10.1115/IMECE2002-39633

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Topics: Reliability, Surface mount components, Failure, Fatigue life, Solder joints, Crack propagation, Fracture (Materials), Geometry, Manufacturing, Solders

Proceedings Papers

On ALT and Field Reliability: Challenges and Solutions

Zhengfang Qian, Joe Tomase

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 63-69, November 15–21, 2003

Paper No: IMECE2003-41668

DOI: https://doi.org/10.1115/IMECE2003-41668

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Topics: Reliability, Databases, Failure, Failure mechanisms, Physics, Statistics

Proceedings Papers

Analytical Solution for BGA Modules Under Thermal/Mechanical Loading

Zhengfang Qian, Joe Tomase

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 417-423, November 13–19, 2004

Paper No: IMECE2004-62073

DOI: https://doi.org/10.1115/IMECE2004-62073

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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Shear (Mechanics)

Proceedings Papers

Mechanical Simulation for the Robust Design of RF-MEMS Switches

Zhengfang Qian, Joe Tomase, Keryn Lian

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 295-301, November 13–19, 2004

Paper No: IMECE2004-60112

DOI: https://doi.org/10.1115/IMECE2004-60112

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Topics: Design, Engineering simulation, Microelectromechanical systems, Switches, Reliability, Shock (Mechanics), Cantilever beams, Dynamic response, Materials properties, Performance evaluation

Proceedings Papers

Integrated Reliability Solutions for New Component Development and Designs Optimization

Xiaohua Wu, Zhengfang Qian, Yinyan Wang

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 131-137, November 5–11, 2005

Paper No: IMECE2005-82320

DOI: https://doi.org/10.1115/IMECE2005-82320

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Topics: Optimization, Reliability, Cycles, Engineering simulation, Engines, Experimental design, Simulation, Stack design, Design, Engineering prototypes

Proceedings Papers

A Method of BGA Bump and Solder Joint Design for Optimal Solderability

Xiaohua Wu, Jay Huang, Zhengfang Qian

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 305-309, November 5–10, 2006

Paper No: IMECE2006-13819

DOI: https://doi.org/10.1115/IMECE2006-13819

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Topics: Ball-Grid-Array packaging, Design, Solder joints, Solders, Algorithms, Design methodology, Stack design

Proceedings Papers

Integrated Reliability Solutions: A Software Tool for Mechanical Reliability of Electronic Components

Yinyan Wang, Chuntao Zhang, Xiaohua Wu, Guoshu Song, Zhengfang Qian

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 409-418, November 5–10, 2006

Paper No: IMECE2006-15542

DOI: https://doi.org/10.1115/IMECE2006-15542

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Topics: Computer software, Electronic components, Reliability, Design, Accelerated life testing, Cycles, Innovation, Manufacturing, Modeling

Proceedings Papers

Progressive Damage of Solder Joints: Modeling, Implementation and Verification

Zhengfang Qian

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 281-288, November 5–10, 2006

Paper No: IMECE2006-13605

DOI: https://doi.org/10.1115/IMECE2006-13605

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Topics: Damage, Modeling, Solder joints, Failure, Algorithms, Alloys, Ball-Grid-Array packages, Computer software, Electronic packages, Engineering simulation

Journal citation

NARROW

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Thermal Mechanical Properties of Two Solder Alloys

On the Life Prediction and Accelerated Testing of Solder Joints

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Seamless Tool Integration for Solder Joint Qualifications

Deterministic and Statistical Reliability of Surface Mount Components

On ALT and Field Reliability: Challenges and Solutions

Analytical Solution for BGA Modules Under Thermal/Mechanical Loading

Mechanical Simulation for the Robust Design of RF-MEMS Switches

Integrated Reliability Solutions for New Component Development and Designs Optimization

A Method of BGA Bump and Solder Joint Design for Optimal Solderability

Integrated Reliability Solutions: A Software Tool for Mechanical Reliability of Electronic Components

Progressive Damage of Solder Joints: Modeling, Implementation and Verification

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