1-14 of 14
Youmin Yu
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
https://doi.org/10.1115/1.4029569
Published Online: June 1, 2015
View Article titled, Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids
Open the PDF for Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids in another window
Topics: Heat transfer, Optimization, Solders, Strips, Reflow soldering
Proceedings Papers

The Effects of Agitator Blade Geometry and Configuration for Augmenting Heat Transfer by Agitation in Channel Flows

Smita Agrawal, Taiho Yeom, Youmin Yu, Mark North, Terrence Simon, Tianhong Cui
Proc. ASME. IMECE2014, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A029, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-37303
https://doi.org/10.1115/IMECE2014-37303
View Paper titled, The Effects of Agitator Blade Geometry and Configuration for Augmenting Heat Transfer by Agitation in Channel Flows
Open the PDF for The Effects of Agitator Blade Geometry and Configuration for Augmenting Heat Transfer by Agitation in Channel Flows in another window
Topics: Blades, Channel flow, Geometry, Heat transfer, Electromagnetic induction, Electronics, Energy consumption, Flow (Dynamics), Heat exchangers, Heat flux
Proceedings Papers

An Active Heat Sink System With Piezoelectric Translational Agitators and Micro Pin Fin Arrays

Taiho Yeom, Terrence W. Simon, Youmin Yu, Min Zhang, Smita Agrawal, Longzhong Huang, Tao Zhang, Mark T. North, Tianhong Cui
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1479-1488, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88449
https://doi.org/10.1115/IMECE2012-88449
View Paper titled, An Active Heat Sink System With Piezoelectric Translational Agitators and Micro Pin Fin Arrays
Open the PDF for An Active Heat Sink System With Piezoelectric Translational Agitators and Micro Pin Fin Arrays in another window
Topics: Heat sinks, Blades, Displacement, Cooling, Flow (Dynamics), Actuators, Carbon fibers, Composite materials, Electronics, Energy dissipation
Proceedings Papers

Development of Synthetic Jet Arrays for Heat Transfer Enhancement in Air-Cooled Heat Sinks for Electronics Cooling

Min Zhang, Taiho Yeom, Youmin Yu, Longzhong Huang, Terrence W. Simon, Mark T. North, Tianhong Cui
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 601-606, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58092
https://doi.org/10.1115/HT2012-58092
View Paper titled, Development of Synthetic Jet Arrays for Heat Transfer Enhancement in Air-Cooled Heat Sinks for Electronics Cooling
Open the PDF for Development of Synthetic Jet Arrays for Heat Transfer Enhancement in Air-Cooled Heat Sinks for Electronics Cooling in another window
Topics: Computer cooling, Heat sinks, Heat transfer, Jets, Channel flow, Energy consumption, Pistons, Actuators, Cavities, Cross-flow
Proceedings Papers

Heat Transfer Enhancement by Synthetic Jet Arrays in Air-Cooled Heat Sinks for Use in Electronics Cooling

Longzhong Huang, Terrence Simon, Min Zhang, Youmin Yu, Mark North, Tianhong Cui
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 659-666, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58278
https://doi.org/10.1115/HT2012-58278
View Paper titled, Heat Transfer Enhancement by Synthetic Jet Arrays in Air-Cooled Heat Sinks for Use in Electronics Cooling
Open the PDF for Heat Transfer Enhancement by Synthetic Jet Arrays in Air-Cooled Heat Sinks for Use in Electronics Cooling in another window
Topics: Computer cooling, Heat sinks, Heat transfer
Proceedings Papers

Comparison of Heat Transfer Enhancement by Actuated Plates in Heat-Sink Channels

Youmin Yu, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 667-674, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58280
https://doi.org/10.1115/HT2012-58280
View Paper titled, Comparison of Heat Transfer Enhancement by Actuated Plates in Heat-Sink Channels
Open the PDF for Comparison of Heat Transfer Enhancement by Actuated Plates in Heat-Sink Channels in another window
Topics: Heat sinks, Heat transfer, Plates (structures)
Proceedings Papers

Convective Heat Transfer Enhancement on a Channel Wall With a High Frequency, Oscillating Agitator

Taiho Yeom, Terrence W. Simon, Youmin Yu, Mark T. North, Tianhong Cui
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 875-884, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64379
https://doi.org/10.1115/IMECE2011-64379
View Paper titled, Convective Heat Transfer Enhancement on a Channel Wall With a High Frequency, Oscillating Agitator
Open the PDF for Convective Heat Transfer Enhancement on a Channel Wall With a High Frequency, Oscillating Agitator in another window
Topics: Convection, Channel flow, Flow (Dynamics), Oscillations, Actuators, Computer simulation, Cooling, Heat transfer, Shells, Cross-flow
Proceedings Papers

A Computational Study of Active Heat Transfer Enhancement of Air-Cooled Heat Sinks by Actuated Plates

Youmin Yu, Terrence Simon, Smita Agrawal, Mark North, Tianhong Cui
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 885-893, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64526
https://doi.org/10.1115/IMECE2011-64526
View Paper titled, A Computational Study of Active Heat Transfer Enhancement of Air-Cooled Heat Sinks by Actuated Plates
Open the PDF for A Computational Study of Active Heat Transfer Enhancement of Air-Cooled Heat Sinks by Actuated Plates in another window
Topics: Heat sinks, Heat transfer, Plates (structures), Air flow, Cooling, Heat flux, Microelectronic devices, Thermal management, Turbulence
Proceedings Papers

Enhancing Heat Transfer of Air-Cooled Heat Sinks Using Piezoelectrically-Driven Agitators and Synthetic Jets

Youmin Yu, Terrence Simon, Min Zhang, Taiho Yeom, Mark North, Tianhong Cui
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 895-903, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64544
https://doi.org/10.1115/IMECE2011-64544
View Paper titled, Enhancing Heat Transfer of Air-Cooled Heat Sinks Using Piezoelectrically-Driven Agitators and Synthetic Jets
Open the PDF for Enhancing Heat Transfer of Air-Cooled Heat Sinks Using Piezoelectrically-Driven Agitators and Synthetic Jets in another window
Topics: Heat sinks, Heat transfer, Jets, Cooling, Channel flow, Computation, Computational fluid dynamics, Computer simulation, Engineering simulation, Geometry
Proceedings Papers

Development of a New Wire Bonding Technology on Integrated Circuit Devices

Yingwei Jiang, Ronglu Sun, Sonder Wang, C. L. Zhang, Youmin Yu, Weimin Chen, Xiao Wei
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 1-7, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89055
https://doi.org/10.1115/InterPACK2009-89055
View Paper titled, Development of a New Wire Bonding Technology on Integrated Circuit Devices
Open the PDF for Development of a New Wire Bonding Technology on Integrated Circuit Devices in another window
Topics: Integrated circuits, Wire bonding, Copper, Wire, Bonding, Reliability, Cycles, Delamination, Flow (Dynamics), High temperature
Proceedings Papers

Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages

Youmin Yu, Denis Bai, Y. W. Jiang, Sonder Wang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 247-252, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89158
https://doi.org/10.1115/InterPACK2009-89158
View Paper titled, Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages
Open the PDF for Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages in another window
Topics: Blades, Optimization, Roads, Strips, Cutting, Wear, Metals, Manufacturing
Proceedings Papers

A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

Youmin Yu, Y. Q. Su, S. A. Yao, Y. W. Jiang, Sonder Wang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 329-334, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89408
https://doi.org/10.1115/InterPACK2009-89408
View Paper titled, A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages
Open the PDF for A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages in another window
Topics: Errors, Heat, Heat transfer, Heating, Optimization, Ovens, Reflow soldering, Reliability, Solders
Proceedings Papers

Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire

Yingwei Jiang, Ronglu Sun, Sonder Wang, Kenny Tan, Youmin Yu, Weimin Chen, Xiao Wei
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 451-457, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89046
https://doi.org/10.1115/InterPACK2009-89046
View Paper titled, Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire
Open the PDF for Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire in another window
Topics: Aluminum, Copper, Wire, Wire bonding, Reliability, Bonding, Manufacturing, Metals, Cycles, Damage
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33335
https://doi.org/10.1115/IPACK2007-33335
View Paper titled, A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication
Open the PDF for A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication in another window
Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation