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Yogendra Joshi
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
Published Online: February 19, 2021
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. April 2021, 143(4): 044502.
Paper No: HT-20-1769
Published Online: February 2, 2021
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
Published Online: January 19, 2021
Journal Articles
Article Type: Research-Article
J. Heat Transfer. March 2021, 143(3): 031501.
Paper No: HT-20-1115
Published Online: January 18, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
Journal Articles
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.
Paper No: JESBC-20-1004
Published Online: June 18, 2020
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
Published Online: June 4, 2020
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
Published Online: May 4, 2020
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021009.
Paper No: EP-18-1078
Published Online: March 19, 2020
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019
Paper No: IPACK2019-6515
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031014.
Paper No: EP-18-1110
Published Online: September 19, 2019
Journal Articles
Article Type: Research-Article
J. Heat Transfer. May 2019, 141(5): 051401.
Paper No: HT-18-1568
Published Online: March 27, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Paper No: IPACK2018-8305
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108
Journal Articles
Article Type: Research-Article
J. Heat Transfer. November 2017, 139(11): 111506.
Paper No: HT-16-1651
Published Online: June 21, 2017
Journal Articles
Article Type: Research-Article
J. Heat Transfer. May 2017, 139(5): 052005.
Paper No: HT-16-1326
Published Online: March 15, 2017
Proceedings Papers

Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A007, November 11–17, 2016
Paper No: IMECE2016-66870