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Yifan Guo
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Proceedings Papers

Die Strength Evaluation in the Presence of Edge Cracks

Betty Leung, Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0507
https://doi.org/10.1115/IMECE1997-0507
View Paper titled, Die Strength Evaluation in the Presence of Edge Cracks
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Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon
Proceedings Papers

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 15-20, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0811
https://doi.org/10.1115/IMECE1997-0811
View Paper titled, Assessment of Chip-Scale Package Design Options
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Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1231
https://doi.org/10.1115/IMECE1997-1231
View Paper titled, Testing and Measurement Techniques Applied to Electronic Packaging Development
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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1223
https://doi.org/10.1115/IMECE1997-1223
View Paper titled, Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure
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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation
Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1233
https://doi.org/10.1115/IMECE1997-1233
View Paper titled, A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry
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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Yifan Guo, Dianne Mitchell, Vijay Sarihan, Dawei Zheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 135-140, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0438
https://doi.org/10.1115/IMECE1998-0438
View Paper titled, A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process
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Topics: Semiconductor wafers, Stress, Testing, Membranes, Sensors, Pressure sensors, Deformation, Residual stresses, Signals
Proceedings Papers

Microtensile Methodology for Mechanical Characterization of Thin Films

Betty H. Yeung, Bill Lytle, Vijay Sarihan, David T. Read, Yifan Guo
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 69-72, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24708
https://doi.org/10.1115/IMECE2001/EPP-24708
View Paper titled, Microtensile Methodology for Mechanical Characterization of Thin Films
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Topics: Thin films, National Institute of Standards and Technology, Materials properties, Materials science, Metallic films, Metals, Optimization, Reliability, Silicon
Proceedings Papers

Warpage Analysis of Panelized Molding Process for Plastic IC Packages

Bhuvaneshwaran Vijayakumar, Yifan Guo
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59168
https://doi.org/10.1115/IMECE2004-59168
View Paper titled, Warpage Analysis of Panelized Molding Process for Plastic IC Packages
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Topics: Molding, Warping, Materials properties, Vehicles, Ball-Grid-Array packaging, Finite element model, Lumber, Manufacturing, Reliability, Simulation results
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
https://doi.org/10.1115/1.1285983
Published Online: December 8, 1999
View Article titled, A Study of Process-Induced Residual Stress in PBGA Packages
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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry
Journal Articles

Finding the Constitutive Relation for a Specific Elastomer

Yun Ling, Peter A. Engel, Wm. L. Brodskey, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 329–336.
https://doi.org/10.1115/1.2909336
Published Online: September 1, 1993
View Article titled, Finding the Constitutive Relation for a Specific Elastomer
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Topics: Elastomers, Compression, Deflection, Deformation, Finite element analysis, Natural rubber, Polynomials, Shear (Mechanics), Springs, Stress
Journal Articles

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

Yifan Guo, Charles G. Woychik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 88–92.
https://doi.org/10.1115/1.2905446
Published Online: March 1, 1992
View Article titled, Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
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Topics: Interferometry, Solder joints, Strain measurement, Surface mount components, Reliability, Solders, Thermal expansion, Dimensions, Electronic packages, Failure