Page 1 | Search Results | ASME Digital Collection

1-12 of 12

Sort by

Sort Order Select

Journal Articles

A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints

Xiaowu Zhang, S-W. Ricky Lee, Mem. ASME,, Yi-Hsin Pao, Mem. ASME,

Publisher: ASME

J. Electron. Packag. September 2000, 122(3): 200–206.

https://doi.org/10.1115/1.1286121

Published Online: October 31, 1999

View Article titled, A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints

Topics: Creep, Damage, Solder joints, Solders, Fatigue life, Manufacturing, Density, Materials properties, Finite element analysis, Stress

Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Z. Guo, Yi-Hsin Pao, H. Conrad

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 100–104.

https://doi.org/10.1115/1.2792074

Published Online: June 1, 1995

View Article titled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature

Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 94–99.

https://doi.org/10.1115/1.2792087

Published Online: June 1, 1995

View Article titled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu

Publisher: ASME

J. Electron. Packag. June 1993, 115(2): 139–140.

https://doi.org/10.1115/1.2909308

Published Online: June 1, 1993

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal Articles

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Yi-Hsin Pao, Ratan Govila, Scott Badgley, Edward Jih

Publisher: ASME

J. Electron. Packag. March 1993, 115(1): 1–8.

https://doi.org/10.1115/1.2909296

Published Online: March 1, 1993

View Article titled, An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Topics: Fatigue, Finite element analysis, Fracture (Materials), Solder joints, Solders, Stress, Creep, Alloys, Cycles, Failure

Journal Articles

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Yi-Hsin Pao, Edward Jih, Bruce E. Artz, Larry W. Cathey

Publisher: ASME

J. Electron. Packag. December 1992, 114(4): 470–472.

https://doi.org/10.1115/1.2905483

Published Online: December 1, 1992

View Article titled, A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Topics: Temperature, Thermal expansion, Errors, Electronic packages, Engineers, Error analysis, Finite element analysis, Finite element model, Modeling, Temperature effects

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone

Publisher: ASME

J. Electron. Packag. June 1992, 114(2): 103.

https://doi.org/10.1115/1.2906403

Published Online: June 1, 1992

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper

Publisher: ASME

J. Electron. Packag. June 1992, 114(2): 135–144.

https://doi.org/10.1115/1.2906410

Published Online: June 1, 1992

View Article titled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys

Journal Articles

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Yi-Hsin Pao, Ellen Eisele

Publisher: ASME

J. Electron. Packag. June 1991, 113(2): 164–172.

https://doi.org/10.1115/1.2905382

Published Online: June 1, 1991

View Article titled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Topics: Shear (Mechanics), Stress, Solder joints, Deflection, Differential equations, Dimensions, Materials properties, Shear stress, Temperature, Temperature controls

Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Peter A. Engel, John H. Lau, Yi-Hsin Pao, Anthony J. Rafanelli, Mohamed Zarrugh, Alex Zubelewicz

Publisher: ASME

J. Electron. Packag. June 1991, 113(2): 91.

https://doi.org/10.1115/1.2905389

Published Online: June 1, 1991

View Article titled, Special Issue on Mechanics of Surface Mount Assemblies

Topics: Surface mount assemblies

Journal Articles

Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

Yi-Hsin Pao, Tsung-Yu Pan

Publisher: ASME

J. Electron. Packag. June 1990, 112(2): 154–161.

https://doi.org/10.1115/1.2904356

Published Online: June 1, 1990

View Article titled, Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

Topics: Fracture (Materials), Stress, Finite element methods, Geometry, Numerical analysis, Shear (Mechanics)

Journal Articles

Deformation in Multilayer Stacked Assemblies

Tsung-Yu Pan, Yi-Hsin Pao

Publisher: ASME

J. Electron. Packag. March 1990, 112(1): 30–34.

https://doi.org/10.1115/1.2904337

Published Online: March 1, 1990

View Article titled, Deformation in Multilayer Stacked Assemblies

Topics: Deformation, Finite element analysis, Geometry, Manufacturing, Polynomials, Silicon, Solders, Stress, Temperature controls, Transistors

Journal citation

NARROW

A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Special Issue on Mechanics of Surface Mount Assemblies

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Special Issue on Mechanics of Surface Mount Assemblies

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Special Issue on Mechanics of Surface Mount Assemblies

Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

Deformation in Multilayer Stacked Assemblies

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only