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Yasushi Nishino
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Proceedings Papers

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Masaru Ishizuka, Tomoyuki Hatakeyama, Risako Kibushi, Yasushi Nishino, Shinji Nakagawa
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1405-1410, November 9–15, 2012
Paper No: IMECE2012-85581
DOI: https://doi.org/10.1115/IMECE2012-85581
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Topics: Air flow, Computational fluid dynamics, Electronics, Engineering simulation, Simulation, Electronic equipment, Flow (Dynamics), Cooling, Heat, Particulate matter
Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 145-153, November 12–18, 2010
Paper No: IMECE2010-37028
DOI: https://doi.org/10.1115/IMECE2010-37028
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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection
Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 547-555, August 8–13, 2010
Paper No: IHTC14-22786
DOI: https://doi.org/10.1115/IHTC14-22786
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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection
Proceedings Papers

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009
Paper No: InterPACK2009-89103
DOI: https://doi.org/10.1115/InterPACK2009-89103
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Topics: Cooling, Dimensions, Electronic equipment, Clearances (Engineering), Copper, Flow (Dynamics), Temperature, Ducts, Particulate matter, Transparency
Proceedings Papers

Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment

Yasushi Nishino, Ryoji Imai, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 757-762, July 8–12, 2007
Paper No: HT2007-32723
DOI: https://doi.org/10.1115/HT2007-32723
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Topics: Clearances (Engineering), Cooling, Electronic equipment, Heating, Temperature, Copper, Modeling, Electronic products, Flow (Dynamics), Natural convection
Proceedings Papers

Experimental Validation of Channeled Wall Passive Cooling Enhancement

Kazuaki Yazawa, Yasushi Nishino, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 709-716, July 17–22, 2005
Paper No: IPACK2005-73078
DOI: https://doi.org/10.1115/IPACK2005-73078
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Topics: Cooling, Composite materials, Design, Electronics, Flow (Dynamics), Numerical analysis, Optimization, Shapes, Temperature, Thermal conductivity