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Yang Ju
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Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A002, July 16–18, 2013
Paper No: IPACK2013-73125
Proceedings Papers

Proc. ASME. PVP2007, Volume 5: High-Pressure Technology; Non-Destructive Evaluation; Student Paper Competition, 177-179, July 22–26, 2007
Paper No: PVP2007-26565
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Paper No: IPACK2003-35117
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003
Paper No: IPACK2003-35118