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Journal Articles

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011004.
Paper No: EP-19-1023
DOI: https://doi.org/10.1115/1.4044625
Published Online: September 19, 2019
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Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives
Proceedings Papers

Vibration Characteristics of Friction Plate of a 6-Speed Planetary Gear Train Base on Multi-Body Dynamic Model

Tinghui Su, Zheng Cao, Yimin Shao, Liming Wang, Hongwu Li, Yan Cheng, Jin Xu
Proc. ASME. IDETC-CIE2017, Volume 10: 2017 ASME International Power Transmission and Gearing Conference, V010T11A011, August 6–9, 2017
Paper No: DETC2017-67045
DOI: https://doi.org/10.1115/DETC2017-67045
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Topics: Dynamic models, Friction, Planetary gears, Trains, Vibration, Damage, Fracture (Materials), Fracture (Process), Plates (structures), Automotive transmissions
Proceedings Papers

TURBOTRANS: A Programming Language for the Performance Simulation of Arbitrary Gas Turbine Engines With Arbitrary Control Systems

J. R. Palmer, Yan Cheng-Zhong
Proc. ASME. GT1982, Volume 5: Manufacturing Materials and Metallurgy; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation; Education; Process Industries; Technology Resources; General, V005T14A004, April 18–22, 1982
Paper No: 82-GT-200
DOI: https://doi.org/10.1115/82-GT-200
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Topics: Computer programming languages, Control systems, Gas turbines, Simulation, Engines, Computers, Modular construction, Steady state, Transients (Dynamics)
Proceedings Papers

Numerical Simulation of the Interaction Between Two Bubbles Rising in the Water

Ren-qing Zhu, Yan-cheng Li, Yong-yan Ni, Pei-tao Zhang
Proc. ASME. OMAE2010, 29th International Conference on Ocean, Offshore and Arctic Engineering: Volume 6, 955-960, June 6–11, 2010
Paper No: OMAE2010-21064
DOI: https://doi.org/10.1115/OMAE2010-21064
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Topics: Bubbles, Computer simulation, Water
Proceedings Papers

A Lab-on-a-Chip Capillary Network for Red Blood Cell Diagnosis

Gou-Jen Wang, Guo-Yang Chen, Yan-Cheng Lin
Proc. ASME. IDETC-CIE2009, Volume 6: ASME Power Transmission and Gearing Conference; 3rd International Conference on Micro- and Nanosystems; 11th International Conference on Advanced Vehicle and Tire Technologies, 409-414, August 30–September 2, 2009
Paper No: DETC2009-87299
DOI: https://doi.org/10.1115/DETC2009-87299
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Topics: Erythrocytes, Blood, Blood flow, Carbon dioxide, Circuits, Diseases, Fluids, Hydrodynamics, Lithography, Modeling