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Y.-W. Mai
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1089-1094, July 17–22, 2005
Paper No: IPACK2005-73047
Journal Articles
Article Type: Research Papers
J. Appl. Mech. March 2008, 75(2): 021007.
Published Online: February 20, 2008
Proceedings Papers

Proc. ASME. IMECE2005, Materials, 585-588, November 5–11, 2005
Paper No: IMECE2005-82205
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
Journal Articles
Article Type: Additional Technical Papers
J. Appl. Mech. January 2006, 73(1): 134–142.
Published Online: March 8, 2005
Journal Articles
Article Type: Brief Notes
J. Appl. Mech. July 2003, 70(4): 611–612.
Published Online: August 25, 2003
Journal Articles
Article Type: Technical Papers
J. Appl. Mech. July 2002, 69(4): 539–546.
Published Online: June 20, 2002