Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Publisher
Journal
Article Type
Conference Series
Subject Area
Topics
Date
Availability
1-12 of 12
Y.-L. Shen
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
Proc. ASME. ICONE25, Volume 8: Computational Fluid Dynamics (CFD) and Coupled Codes; Nuclear Education, Public Acceptance and Related Issues, V008T09A033, July 2–6, 2017
Publisher: American Society of Mechanical Engineers
Paper No: ICONE25-67026
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021011.
Paper No: EP-14-1045
Published Online: June 1, 2015
Proceedings Papers
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1001-1010, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87728
Proceedings Papers
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 863-872, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87751
Proceedings Papers
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 289-294, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70038
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1323-1330, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73450
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
Published Online: February 11, 2009
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 101-107, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35030
Proceedings Papers
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 71-78, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32885
Proceedings Papers
Proc. ASME. IMECE2004, Materials, 71-77, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60560
Proceedings Papers
Proc. ASME. IMECE2004, Materials, 117-122, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61393
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
Published Online: June 29, 2000