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Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997

Paper No: IMECE1997-0956

DOI: https://doi.org/10.1115/IMECE1997-0956

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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)

Proceedings Papers

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Per G. Sverdrup, Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999

Paper No: IMECE1999-1061

DOI: https://doi.org/10.1115/IMECE1999-1061

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Topics: Engineering simulation, Heat conduction, Silicon-on-insulator, Simulation, Transistors, Phonons, Silicon, Temperature, Thermal diffusion, Mean free path

Proceedings Papers

Analysis and Characterization of Thermoelectric Microrefrigerators

Y. Sungtaek Ju

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 315-317, November 5–10, 2000

Paper No: IMECE2000-1441

DOI: https://doi.org/10.1115/IMECE2000-1441

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Topics: Contact resistance, Cooling, Electromagnetic scattering, Heat flux, Phonons, Quantum wells, Radiation scattering, Reflection, Scattering (Physics), Superlattices

Proceedings Papers

Theoretical Analysis of Pyroelectric Harvesting of Low-Grade Exhaust Waste Heat

Y. Sungtaek Ju

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A058, November 13–19, 2015

Paper No: IMECE2015-53042

DOI: https://doi.org/10.1115/IMECE2015-53042

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Topics: Exhaust systems, Theoretical analysis, Waste heat, Combined heat and power, Design, Coolants, Convection, Cycles, Ducts, Energy efficiency

Proceedings Papers

Study of the Fluid Dynamics of Thin Liquid Films Flowing Down a Vertical String With Counterflow of Gas

Zezhi Zeng, Gopinath Warrier, Y. Sungtaek Ju

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A054, November 13–19, 2015

Paper No: IMECE2015-53132

DOI: https://doi.org/10.1115/IMECE2015-53132

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Topics: Fluid dynamics, Lubrication theory, String, Coolants, Heat transfer, Liquid films, Computer simulation, Design, Flow (Dynamics), Fluids

Proceedings Papers

Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces

Zezhi Zeng, Gopinath Warrier, Y. Sungtaek Ju

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A012, July 6–9, 2015

Paper No: IPACK2015-48149

DOI: https://doi.org/10.1115/IPACK2015-48149

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Topics: Flow (Dynamics), Heat transfer, Liquid films, Heat exchangers, Cooling, Design, String, Shapes, Computer simulation, Evaporative cooling

Proceedings Papers

Development of High Temperature Liquid Metal Heat Transfer Fluids for CSP Applications

Gopinath R. Warrier, Y. Sungtaek Ju, Jan Schroers, Mark Asta, Peter Hosemann

Proc. ASME. ES2014, Volume 1: Combined Energy Cycles, CHP, CCHP, and Smart Grids; Concentrating Solar Power, Solar Thermochemistry and Thermal Energy Storage; Geothermal, Ocean, and Emerging Energy Technologies; Hydrogen Energy Technologies; Low/Zero Emission Power Plants and Carbon Sequestration; Photovoltaics; Wind Energy Systems and Technologies, V001T02A046, June 30–July 2, 2014

Paper No: ES2014-6611

DOI: https://doi.org/10.1115/ES2014-6611

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Topics: Fluids, Heat transfer, High temperature, Liquid metals, Modeling, Corrosion, Metals, Alloys, Melting, Oxygen

Proceedings Papers

Deployable MEMS Devices for Minimally Invasive Monitoring of Cortical Activities

Jinda Zhuang, Y. Sungtaek Ju

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A007, November 15–21, 2013

Paper No: IMECE2013-66662

DOI: https://doi.org/10.1115/IMECE2013-66662

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Topics: Brain, Electrodes, Electroencephalography, Microelectromechanical systems, Near-infrared spectroscopy, Resolution (Optics)

Proceedings Papers

Heat Transfer Performance of Superhydrophilic Nanostructured Cu Micropost Wicks for Micro Heat Pipes

Youngsuk Nam, Stephen Sharratt, Y. Sungtaek Ju

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 55-60, November 12–18, 2010

Paper No: IMECE2010-40242

DOI: https://doi.org/10.1115/IMECE2010-40242

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Topics: Heat pipes, Heat transfer, Critical heat flux, Heat transfer coefficients, Thermal management, Copper, Density, Design, Electronics, Experimental methods

Proceedings Papers

Performance Modeling of Micropost Wicks for Micro Heat Pipes at Low Heat Fluxes

Stephen Sharratt, Youngsuk Nam, Y. Sungtaek Ju

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 61-67, November 12–18, 2010

Paper No: IMECE2010-40719

DOI: https://doi.org/10.1115/IMECE2010-40719

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Topics: Flux (Metallurgy), Heat, Heat pipes, Modeling, Heat transfer, Fluids, Equilibrium (Physics), Geometry, Heat transfer coefficients, Thin films

Journal Articles

An Investigation of a Tunable Magnetomechanical Thermal Switch

Katherine E. Bulgrin, Y. Sungtaek Ju, Greg P. Carman, Adrienne S. Lavine

J. Heat Transfer. October 2011, 133(10): 101401.

DOI: https://doi.org/10.1115/1.4004166

Published Online: August 11, 2011

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Topics: Elastic constants, Switches, Temperature, Gadolinium, Electrical conductance, Actuators

Journal Articles

Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks

Youngsuk Nam, Stephen Sharratt, Gilhwan Cha, Y. Sungtaek Ju

J. Heat Transfer. October 2011, 133(10): 101502.

DOI: https://doi.org/10.1115/1.4004168

Published Online: August 11, 2011

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Topics: Copper, Heat, Heat pipes, Heat transfer, Heat transfer coefficients, Modeling, Oxidation, Shapes, Temperature, Semiconductor devices

Proceedings Papers

Liquid Supply and Heat Transfer Performance of Sintered Cu Monolayer Wicks for Phase Change Heat Transfer Applications

Stephen Sharratt, Youngsuk Nam, Y. Sungtaek Ju

Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10124, March 13–17, 2011

Paper No: AJTEC2011-44356

DOI: https://doi.org/10.1115/AJTEC2011-44356

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Topics: Heat transfer, Copper powders, Critical heat flux, Flux (Metallurgy), Heat, Heat pipes, Sintering, Thermal conductivity, Thermal resistance, Vapors

Journal Articles

Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

Y. Sungtaek Ju

J. Electron. Packag. December 2010, 132(4): 041004.

DOI: https://doi.org/10.1115/1.4002896

Published Online: November 23, 2010

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Topics: Cooling, Electrodes, Temperature, Thermal conductivity, Manufacturing

Proceedings Papers

A Coupled Thermal and Mechanical Model of a Thermal Energy Harvesting Device

Katherine E. Bulgrin, Y. Sungtaek Ju, Greg P. Carman, Adrienne S. Lavine

Proc. ASME. IMECE2009, Volume 6: Emerging Technologies: Alternative Energy Systems; Energy Systems: Analysis, Thermodynamics and Sustainability, 327-335, November 13–19, 2009

Paper No: IMECE2009-13040

DOI: https://doi.org/10.1115/IMECE2009-13040

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Topics: Thermal energy, Temperature, Actuators, Energy conversion, Thermomechanics

Proceedings Papers

Liquid-Mediated Reversible Thermal Interface for Satellite Thermal Management

Gilhwan Cha, Y. Sungtaek Ju

Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 927-929, November 13–19, 2009

Paper No: IMECE2009-12429

DOI: https://doi.org/10.1115/IMECE2009-12429

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Topics: Satellites, Thermal management, Atomic clocks, Bolometers, Thermal conductivity, Thermal energy, Thermoelectric cooling

Proceedings Papers

A Tunable Magnetomechanical Thermal Switch for Thermal Management Purposes

Katherine E. Bulgrin, Y. Sungtaek Ju, Greg P. Carman, Adrienne S. Lavine

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 997-1003, July 19–23, 2009

Paper No: HT2009-88571

DOI: https://doi.org/10.1115/HT2009-88571

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Topics: Switches, Thermal management, Electrical conductance, Heat, Temperature, Computer simulation, Design, Ferromagnetic materials, Heat flux, Temperature effects

Journal Articles

Experimental and Numerical Study of Single Bubble Dynamics on a Hydrophobic Surface

Youngsuk Nam, Jinfeng Wu, Gopinath Warrier, Y. Sungtaek Ju

J. Heat Transfer. December 2009, 131(12): 121004.

DOI: https://doi.org/10.1115/1.3216038

Published Online: October 15, 2009

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Topics: Bubbles, Dynamics (Mechanics), Semiconductor wafers

Proceedings Papers

Comparative Study of Copper Oxidation Schemes and Their Effects on Surface Wettability

Youngsuk Nam, Y. Sungtaek Ju

Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1833-1838, October 31–November 6, 2008

Paper No: IMECE2008-67492

DOI: https://doi.org/10.1115/IMECE2008-67492

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Topics: Copper, Oxidation, Nanostructures , Atomic force microscopy, Heat transfer, Heating, Scanning electron microscopy, Surface roughness, Temperature, X-ray diffraction

Proceedings Papers

Bubble Nucleation on Nanoscopically Smooth Hydrophobic Islands

Youngsuk Nam, Y. Sungtaek Ju

Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 567-571, October 31–November 6, 2008

Paper No: IMECE2008-67483

DOI: https://doi.org/10.1115/IMECE2008-67483

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Topics: Bubbles, Nucleation (Physics), Water, Photolithography, Pool boiling, Silicon

Journal citation

NARROW

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Analysis and Characterization of Thermoelectric Microrefrigerators

Theoretical Analysis of Pyroelectric Harvesting of Low-Grade Exhaust Waste Heat

Study of the Fluid Dynamics of Thin Liquid Films Flowing Down a Vertical String With Counterflow of Gas

Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces

Development of High Temperature Liquid Metal Heat Transfer Fluids for CSP Applications

Deployable MEMS Devices for Minimally Invasive Monitoring of Cortical Activities

Heat Transfer Performance of Superhydrophilic Nanostructured Cu Micropost Wicks for Micro Heat Pipes

Performance Modeling of Micropost Wicks for Micro Heat Pipes at Low Heat Fluxes

An Investigation of a Tunable Magnetomechanical Thermal Switch

Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks

Liquid Supply and Heat Transfer Performance of Sintered Cu Monolayer Wicks for Phase Change Heat Transfer Applications

Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

A Coupled Thermal and Mechanical Model of a Thermal Energy Harvesting Device

Liquid-Mediated Reversible Thermal Interface for Satellite Thermal Management

A Tunable Magnetomechanical Thermal Switch for Thermal Management Purposes

Experimental and Numerical Study of Single Bubble Dynamics on a Hydrophobic Surface

Comparative Study of Copper Oxidation Schemes and Their Effects on Surface Wettability

Bubble Nucleation on Nanoscopically Smooth Hydrophobic Islands

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