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Proceedings Papers

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 243-249, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24731
https://doi.org/10.1115/IMECE2001/EPP-24731
View Paper titled, Failure Analysis of Miniature Solder Specimen
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Topics: Failure analysis, Solders, Damage, Engineering simulation, Simulation, Finite element analysis, Tension, ASTM International, ASTM standards, Constitutive equations
Proceedings Papers

Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material

Y. Wei, C. L. Chow, M. K. Neilsen, H. E. Fang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 161-165, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2258
https://doi.org/10.1115/IMECE2000-2258
View Paper titled, Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material
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Topics: Damage mechanics, Fatigue life, Solders, Damage, Fatigue damage, Computer simulation, Failure
Proceedings Papers

Influence of a Taut Cable on the Performance of a Point-Absorber Wave Energy Converter

R. Wang, Y. Wei, M. van Rooij, B. Jayawardhana, A. I. Vakis
Proc. ASME. OMAE2018, Volume 10: Ocean Renewable Energy, V010T09A038, June 17–22, 2018
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2018-77490
https://doi.org/10.1115/OMAE2018-77490
View Paper titled, Influence of a Taut Cable on the Performance of a Point-Absorber Wave Energy Converter
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Topics: Cables, Wave energy converters, Critical points (Physics), Renewable energy, Buoys, Design, Frequency-domain analysis, Seas, Tension
Proceedings Papers

A Fourier Approximation Method for the Multi-Pump Multi-Piston Power Take-Off System

Y. Wei, J. J. Barradas-Berglind, M. Z. Almuzakki, M. van Rooij, R. Wang, B. Jayawardhana, A. I. Vakis
Proc. ASME. OMAE2018, Volume 10: Ocean Renewable Energy, V010T09A015, June 17–22, 2018
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2018-77498
https://doi.org/10.1115/OMAE2018-77498
View Paper titled, A Fourier Approximation Method for the Multi-Pump Multi-Piston Power Take-Off System
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Topics: Approximation, Pistons, Pumps, Computer simulation, Buoys, Design, Dynamics (Mechanics), Equations of motion, Fourier series, Nonlinear dynamics
Proceedings Papers

A Human Factors Analysis Method for Marine Accident Evolution Using HFACS-EI Model

X. Y. Wei, Y. Wang, X. P. Yan, B. Wu, Y. F. Tian
Proc. ASME. OMAE2015, Volume 7: Ocean Engineering, V007T06A049, May 31–June 5, 2015
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2015-41858
https://doi.org/10.1115/OMAE2015-41858
View Paper titled, A Human Factors Analysis Method for Marine Accident Evolution Using HFACS-EI Model
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Topics: Human factors, Marine accidents, Accidents, Errors, Ocean engineering, Ships
Proceedings Papers

Effect of Deposition Temperature on I-V Characteristics of Vanadium Oxide Film

X. Y. Wei, M. Hu, F. Wang, J. Wei, K. L. Zhang
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 419-422, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87232
https://doi.org/10.1115/IMECE2012-87232
View Paper titled, Effect of Deposition Temperature on I-V Characteristics of Vanadium Oxide Film
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Topics: Temperature, Thin films, Electrical resistivity, Photoelectron spectroscopy, Semiconductor devices, Sputtering (Irradiation), X-rays
Proceedings Papers

Prediction of Fracture and Fatigue Damage in Engineering Structures

Y. Wei, C. L. Chow
Proc. ASME. PVP2002, New and Emerging Computational Methods: Applications to Fracture, Damage, and Reliability, 187-191, August 5–9, 2002
Publisher: American Society of Mechanical Engineers
Paper No: PVP2002-1207
https://doi.org/10.1115/PVP2002-1207
View Paper titled, Prediction of Fracture and Fatigue Damage in Engineering Structures
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Topics: Fatigue damage, Fracture (Materials), Fracture (Process), Structures, Damage, Failure analysis, Damage mechanics, Failure, Fatigue failure, Finite element analysis
Proceedings Papers

Constitutive Model for Sn-Pb Solder Under Fatigue Loading

Y. Wei, C. L. Chow, M. K. Nielsen, H. E. Fang
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 199-205, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39186
https://doi.org/10.1115/IMECE2002-39186
View Paper titled, Constitutive Model for Sn-Pb Solder Under Fatigue Loading
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Topics: Constitutive equations, Fatigue, Solders, Tin, Alloys, Damage, Fatigue failure, Fatigue life, Materials degradation, Mechanical behavior
Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
https://doi.org/10.1115/1.1773197
Published Online: October 6, 2004
View Article titled, Behavior of Lead-Free Solder Under Thermomechanical Loading
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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

An On-line Condition Monitoring and Diagnosis System for Feed Rolls in the Plate Mill

J. J. Jeng, Associate Scientist, C. Y. Wei, Associate Scientist
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2002, 124(1): 52–57.
https://doi.org/10.1115/1.1286133
Published Online: November 1, 1999
View Article titled, An On-line Condition Monitoring and Diagnosis System for Feed Rolls in the Plate Mill
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Topics: Bearings, Condition monitoring, Signals, Vibration, Shock (Mechanics)
Journal Articles

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 278–283.
https://doi.org/10.1115/1.1372319
Published Online: October 20, 1999
View Article titled, Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material
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Topics: Creep, Damage, Solders, Tin, Stress
Journal Articles

Evaluation of Wear Resistance of Snow Plow Blade Cutting Edges Using the Scratch Test Method

Y Wei, WA Nixon, Z Shi
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. November 1998, 26(6): 527–531.
https://doi.org/10.1520/JTE12110J
Published Online: November 1, 1998
View Article titled, Evaluation of Wear Resistance of Snow Plow Blade Cutting Edges Using the Scratch Test Method
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eBook Chapter

A Fatigue Damage Model for Crack Propagation

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1996
https://doi.org/10.1520/STP16133S
ISBN-10: 0-8031-2029-X
ISBN: 978-0-8031-2029-7
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Journal Articles

Effect of Turbulent Heat Transfer on Continuous Ingot Solidification

W. Shyy, Y. Pang, G. B. Hunter, D. Y. Wei, M.-H. Chen
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. January 1993, 115(1): 8–16.
https://doi.org/10.1115/1.2902163
Published Online: January 1, 1993
View Article titled, Effect of Turbulent Heat Transfer on Continuous Ingot Solidification
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Topics: Solidification, Turbulent heat transfer, Turbulence, Casting, Fluctuations (Physics), Temperature, Accounting, Buoyancy, Cathode ray oscilloscopes, Convection