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Journal Articles

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng

J. Electron. Packag. March 2004, 126(1): 94–99.

DOI: https://doi.org/10.1115/1.1648061

Published Online: April 30, 2004

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Topics: Delamination, Finite element analysis, Flip-chip, Flip-chip assemblies, Fracture (Materials), Simulation, Fracture mechanics, Flip-chip devices, Crack propagation, Cycles

Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

J. Electron. Packag. March 2003, 125(1): 84–92.

DOI: https://doi.org/10.1115/1.1533802

Published Online: March 14, 2003

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Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion

Journal Articles

An Asperity Contact Model for the Slider Air Bearing

Weidong Huang, David B. Bogy, Masayuki Honchi

J. Tribol. April 2000, 122(2): 436–443.

DOI: https://doi.org/10.1115/1.555379

Published Online: June 29, 1999

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Topics: Air bearings, Disks

Journal Articles

The Effect of the Accommodation Coefficient on Slider Air Bearing Simulation

Weidong Huang, David B. Bogy, Fellow ASME

J. Tribol. April 2000, 122(2): 427–435.

DOI: https://doi.org/10.1115/1.555384

Published Online: June 8, 1999

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Topics: Air bearings, Disks, Flow (Dynamics), Poiseuille flow, Pressure, Simulation, Databases, Lubrication, Reflection

Journal citation

NARROW

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

An Asperity Contact Model for the Slider Air Bearing

The Effect of the Accommodation Coefficient on Slider Air Bearing Simulation

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

An Asperity Contact Model for the Slider Air Bearing

The Effect of the Accommodation Coefficient on Slider Air Bearing Simulation

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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