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Vikas Yadav
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Journal Articles

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: November 10, 2023
View Article titled, Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
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Topics: Solders, Temperature, Shock (Mechanics), Alloys
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74068
https://doi.org/10.1115/IPACK2021-74068
View Paper titled, Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage
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Topics: Alloys, High temperature, Low temperature materials, Solders, Storage
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
https://doi.org/10.1115/IPACK2020-2658
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Journal Articles

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
https://doi.org/10.1115/1.4048181
Published Online: October 8, 2020
View Article titled, Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
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Topics: Alloys, Solders, Temperature, Stress, Solder joints, Operating temperature
Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
https://doi.org/10.1115/1.4047579
Published Online: July 10, 2020
View Article titled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6577
https://doi.org/10.1115/IPACK2019-6577
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
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Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics
Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6580
https://doi.org/10.1115/IPACK2019-6580
View Paper titled, Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements
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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing
Proceedings Papers

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8357
https://doi.org/10.1115/IPACK2018-8357
View Paper titled, Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage
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Topics: Constitutive equations, High temperature, Lead-free solders, Mechanical properties, Storage, Solders, Alloys, Drilling, Electronics, Geometry
Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74233
https://doi.org/10.1115/IPACK2017-74233
View Paper titled, Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
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Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry
Proceedings Papers

New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink

Vikas Yadav, Ritunesh Kumar
Proc. ASME. FEDSM2017, Volume 1B, Symposia: Fluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods, V01BT10A004, July 30–August 3, 2017
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM2017-69084
https://doi.org/10.1115/FEDSM2017-69084
View Paper titled, New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Microchannels, Design, Temperature distribution, Cooling, Energy transformation, Finite volume methods, Fluid dynamics, Fluids
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48389
https://doi.org/10.1115/IPACK2015-48389
View Paper titled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Wavelet Transform for Human Gait With an Asymmetric Load

Cosmin Berceanu, Dan Marghitu, Maruti Ram Gudavalli, P. K. Raju, Vikas Yadav
Proc. ASME. IMECE2014, Volume 3: Biomedical and Biotechnology Engineering, V003T03A061, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39751
https://doi.org/10.1115/IMECE2014-39751
View Paper titled, Wavelet Transform for Human Gait With an Asymmetric Load
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Topics: Stress, Wavelet transforms, Wavelets, Cycles, Discrete wavelet transforms, Kinematics, Signals, Students, Weight (Mass)
Proceedings Papers

Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods

Vikas Yadav, Maruti Ram Gudavalli, P. K. Raju, Dan Marghitu
Proc. ASME. IMECE2014, Volume 3: Biomedical and Biotechnology Engineering, V003T03A022, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39720
https://doi.org/10.1115/IMECE2014-39720
View Paper titled, Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods
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Topics: Biomechanics, Stress, Electromyography, Muscle, Cycles, Dimensions, Entropy, Matlab, Fatigue, Musculoskeletal system
Proceedings Papers

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Pradeep Lall, Di Zhang, Vikas Yadav
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A069, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39518
https://doi.org/10.1115/IMECE2014-39518
View Paper titled, High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature
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Topics: High temperature, Solders, Temperature, Deformation, Lead-free solders, Alloys, Chemical properties, Constitutive equations, Electronic components, Electronic packaging
Proceedings Papers

Development of Force-Feedback Technology for Training Clinicians to Deliver Manual Cervical Distraction

Maruti Ram Gudavalli, Vikas Yadav, Robert Vining, Michael Seidman, Stacie Salsbury, Paige Morgenthal, Avinash Patwardhan, Christine Goertz
Proc. ASME. IMECE2013, Volume 3A: Biomedical and Biotechnology Engineering, V03AT03A036, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-64509
https://doi.org/10.1115/IMECE2013-64509
View Paper titled, Development of Force-Feedback Technology for Training Clinicians to Deliver Manual Cervical Distraction
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Topics: Bioengineering, Cervical spine, Computer software, Feedback, Force feedback, Instrumentation, Musculoskeletal system, Patient treatment, Students, Traction
Journal Articles

Probabilistic Approach to Modeling of 3D Objects using Silhouettes

Ankur Jain, Vikas Yadav, Ankush Mittal, Sumit Gupta
Journal: Journal of Computing and Information Science in Engineering
Publisher: ASME
Article Type: Technical Papers
J. Comput. Inf. Sci. Eng. December 2006, 6(4): 381–389.
https://doi.org/10.1115/1.2364206
Published Online: September 16, 2006
View Article titled, Probabilistic Approach to Modeling of 3D Objects using Silhouettes
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Topics: Algorithms, Construction, Probability, Three-dimensional models, Calibration, Three-dimensional modeling, Noise (Sound)