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Victor Chiriac
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Journal Articles

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
https://doi.org/10.1115/1.4029569
Published Online: June 1, 2015
View Article titled, Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids
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Topics: Heat transfer, Optimization, Solders, Strips, Reflow soldering
Proceedings Papers

Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules

Victor Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 371-378, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89136
https://doi.org/10.1115/InterPACK2009-89136
View Paper titled, Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules
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Topics: Optimization, Steady state, Transients (Dynamics), Temperature, Automotive industry, Boundary-value problems, Computer simulation, Corners (Structural elements), Heat, Heat budget (Physics)
Proceedings Papers

System Level Transient Thermal Performance of High-Power Dynamic Microelectronics

Victor Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89110
https://doi.org/10.1115/InterPACK2009-89110
View Paper titled, System Level Transient Thermal Performance of High-Power Dynamic Microelectronics
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Topics: Computer simulation, Microelectronic devices, Motors, Transients (Dynamics)
Proceedings Papers

Numerical Evaluation of 2D and 3D Steady and Unsteady Flows of a Pair of Opposing Confined Impinging Air Jets

Victor Chiriac, Jorge L. Rosales
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 495-502, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88303
https://doi.org/10.1115/HT2009-88303
View Paper titled, Numerical Evaluation of 2D and 3D Steady and Unsteady Flows of a Pair of Opposing Confined Impinging Air Jets
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Topics: Air jets, Cooling, Jets, Unsteady flow, Flow (Dynamics), Reynolds number, Heat transfer, Vortices, Buckling, Convection
Proceedings Papers

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33705
https://doi.org/10.1115/IPACK2007-33705
View Paper titled, Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources
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Topics: Computer simulation, Heat, Performance evaluation, Transients (Dynamics), Cycles, Heat budget (Physics), Signals, Copper, Design, Dynamic systems
Proceedings Papers

Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling

Victor Chiriac, Florea Chiriac
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 87-92, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33726
https://doi.org/10.1115/IPACK2007-33726
View Paper titled, Miniaturized Refrigeration System With Absorption: Application to Microelectronics Cooling
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Topics: Absorption, Compressors, Cooling, Heat exchangers, Microelectronic devices, Refrigeration
Proceedings Papers

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33707
https://doi.org/10.1115/IPACK2007-33707
View Paper titled, System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices
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Topics: Lightning, Optimization, Energy dissipation, Temperature, Design, Pins (Engineering), Heat, Heat budget (Physics), Junctions, Automotive industry
Proceedings Papers

System Level Thermal Evaluation and Optimization of an Automotive Module Incorporating Several Power Packages

Victor Chiriac, Tom Lee, Kim Gauen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 113-118, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73100
https://doi.org/10.1115/IPACK2005-73100
View Paper titled, System Level Thermal Evaluation and Optimization of an Automotive Module Incorporating Several Power Packages
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Topics: Automotive industry, Computational fluid dynamics, Computer simulation, Design, Energy dissipation, Heat, Heat budget (Physics), Heat conduction, Heat transfer coefficients, Heating
Proceedings Papers

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

Victor Chiriac, Tom Lee, Arvind Krishna, Venkata Krishnan, Rodney Lawrence
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73101
https://doi.org/10.1115/IPACK2005-73101
View Paper titled, System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application
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Topics: Automotive industry, Boundary-value problems, Computer cooling, Design, Electrical conductivity, Modeling, Simulation, Steady state, Temperature, Thermal analysis
Proceedings Papers

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 425-430, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73284
https://doi.org/10.1115/IPACK2005-73284
View Paper titled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
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Topics: Compression, Cooling, Microchannels, Microelectronic devices, Refrigeration, Vapors
Proceedings Papers

The Cooling Impact of a Pair of Opposed Unsteady Confined Impinging Air Jets

Victor Chiriac, Jorge L. Rosales
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 461-467, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73310
https://doi.org/10.1115/IPACK2005-73310
View Paper titled, The Cooling Impact of a Pair of Opposed Unsteady Confined Impinging Air Jets
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Topics: Air jets, Cooling, Jets, Reynolds number, Flow (Dynamics), Heat transfer, Unsteady flow, Bubbles, Convection, Displacement
Proceedings Papers

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Patrick E. Phelan, Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 309-315, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35140
https://doi.org/10.1115/IPACK2003-35140
View Paper titled, Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging
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Topics: Electronic packaging, Refrigeration, Compression, Vapors, Compressors, Cycles, Microelectronic devices, Thermoelectric coolers
Journal Articles

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
https://doi.org/10.1115/1.2993148
Published Online: November 13, 2008
View Article titled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
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Topics: Compressors, Condensers (steam plant), Cooling, Design, Microchannels, Refrigerants, Refrigeration, Vapors, Compression, Microelectronic devices
Proceedings Papers

Thermal Performance Evaluation of New Power QFN (Quad Flat No Lead) Packages for Automotive Applications

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 171-180, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59628
https://doi.org/10.1115/IMECE2004-59628
View Paper titled, Thermal Performance Evaluation of New Power QFN (Quad Flat No Lead) Packages for Automotive Applications
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Topics: Automotive industry, Performance evaluation, Temperature, Transients (Dynamics), Steady state, Boundary-value problems, Computational fluid dynamics, Corners (Structural elements), Heat, Heat conduction
Proceedings Papers

Modeling Strategy in Evaluating Thermal Performance of an RF Module for Wireless Communications

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 267-272, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62077
https://doi.org/10.1115/IMECE2004-62077
View Paper titled, Modeling Strategy in Evaluating Thermal Performance of an RF Module for Wireless Communications
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Topics: Modeling, Temperature, Bridges (Structures), Heat, Stress, Computational fluid dynamics, Design, Energy dissipation, Heat budget (Physics), Heat conduction
Proceedings Papers

The Miniaturization of a Refrigeration Vapor Compression System and Application to the Cooling of High Power Microelectronics

Victor Chiriac, Florin Chiriac
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 193-198, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14537
https://doi.org/10.1115/IMECE2006-14537
View Paper titled, The Miniaturization of a Refrigeration Vapor Compression System and Application to the Cooling of High Power Microelectronics
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Topics: Compression, Cooling, Ejectors, Microelectronic devices, Refrigeration, Vapors