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Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 671-677, July 8–12, 2007

Paper No: IPACK2007-33844

DOI: https://doi.org/10.1115/IPACK2007-33844

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Topics: Gallium arsenide, Wire, Flip-chip, Flip-chip devices, Simulation, Design, Heat, Heat transfer, Solders, Vehicles

Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 105-112, July 17–22, 2005

Paper No: IPACK2005-73090

DOI: https://doi.org/10.1115/IPACK2005-73090

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Topics: Telecommunications, Transients (Dynamics), Cycles, Steady state, Temperature, Waves, Junctions, Capacitors, Computation, Computer software

Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 381-387, July 6–11, 2003

Paper No: IPACK2003-35183

DOI: https://doi.org/10.1115/IPACK2003-35183

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Topics: Air jets, Cooling, Microelectronic devices, Jets, Reynolds number, Heat transfer, Flow (Dynamics), Heat, Bubbles, Heat transfer coefficients