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Tushar Chauhan
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Proceedings Papers

CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid

Amirreza Niazmand, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 27–29, 2020
Paper No: IPACK2020-2595
DOI: https://doi.org/10.1115/IPACK2020-2595
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Topics: Computational fluid dynamics, Cooling, Electronics, Fluids, Simulation
Proceedings Papers

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 7–9, 2019
Paper No: IPACK2019-6568
DOI: https://doi.org/10.1115/IPACK2019-6568
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Topics: Cooling, Electronic packages, Printed circuit boards, Reliability, Thermomechanics
Proceedings Papers

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

Dhruvkumar Gandhi, Uschas Chowdhury, Tushar Chauhan, Pratik Bansode, Satyam Saini, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 7–9, 2019
Paper No: IPACK2019-6587
DOI: https://doi.org/10.1115/IPACK2019-6587
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Topics: Cooling, Fluids, Optimization
Proceedings Papers

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

Pravin A. Shinde, Pratik V. Bansode, Satyam Saini, Rajesh Kasukurthy, Tushar Chauhan, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 7–9, 2019
Paper No: IPACK2019-6590
DOI: https://doi.org/10.1115/IPACK2019-6590
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Topics: Cooling, Data centers, Experimental analysis, Optimization, Temperature
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
DOI: https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability