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Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201.

Paper No: EP-16-1019

DOI: https://doi.org/10.1115/1.4032748

Published Online: March 10, 2016

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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards

Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015

Paper No: IPACK2015-48168

DOI: https://doi.org/10.1115/IPACK2015-48168

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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)

Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013

Paper No: IPACK2013-73126

DOI: https://doi.org/10.1115/IPACK2013-73126

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Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties

Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki

Paper No: IPACK2013-73248

DOI: https://doi.org/10.1115/IPACK2013-73248

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Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors

Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki

J. Electron. Packag. December 2013, 135(4): 041005.

Paper No: EP-10-1084

DOI: https://doi.org/10.1115/1.4025527

Published Online: November 5, 2013

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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties

Proceedings Papers

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method

Toru Ikeda, Hiroshi Hirai, Mitsutoshi Abe, Masatsugu Chiba, Noriyuki Miyazaki

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 463-471, July 6–8, 2011

Paper No: IPACK2011-52073

DOI: https://doi.org/10.1115/IPACK2011-52073

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Topics: Corners (Structural elements), Stress, Anisotropy, Piezoelectric materials, Eigenvalues, Electronic packages, Finite element methods, Microelectromechanical systems, Eigenfunctions, Failure

Proceedings Papers

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

Paper No: IPACK2011-52150

DOI: https://doi.org/10.1115/IPACK2011-52150

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Topics: Metal oxide semiconductors, Stress, Transistors, Simulation, Electron mobility, Computer simulation, Diffusion (Physics), Electrons, Flow (Dynamics), Gates (Closures)

Proceedings Papers

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 119-124, July 19–23, 2009

Paper No: InterPACK2009-89112

DOI: https://doi.org/10.1115/InterPACK2009-89112

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Topics: Simulation, Stress, Stress concentration, Physics, Diffusion (Physics), Semiconductor devices, Simulation models, Computer simulation, Electron mobility, Gates (Closures)

Proceedings Papers

Hygro-Mechanical Analysis of LCD Panels

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 815-824, July 19–23, 2009

Paper No: InterPACK2009-89267

DOI: https://doi.org/10.1115/InterPACK2009-89267

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Topics: Adhesives, Boundary layers, Deformation, Diffusion (Physics), Finite element methods, Gas laws (Thermodynamics), Glass, Liquid crystals, Manufacturing, Plates (structures)

Journal Articles

Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

J. Electron. Packag. March 2010, 132(1): 011003.

DOI: https://doi.org/10.1115/1.4000718

Published Online: March 4, 2010

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Topics: Electron mobility, Molding, Resins, Stress, Silicon

Proceedings Papers

Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 465-472, July 8–12, 2007

Paper No: IPACK2007-33212

DOI: https://doi.org/10.1115/IPACK2007-33212

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Topics: Stress analysis (Engineering), Thermomechanics, Finite element methods, Polarizers (Light), Liquid crystals, Warping, Diffusion (Physics), Leakage, Stress, Thermal stresses

Proceedings Papers

Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 277-284, July 8–12, 2007

Paper No: IPACK2007-33533

DOI: https://doi.org/10.1115/IPACK2007-33533

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Topics: Resins, Stress, Electron mobility, Molding, Diffusion (Physics), Experimental analysis, Silicon chips, Simulation

Proceedings Papers

Experimental and Numerical Evaluation of Residual Stress in IC Chips

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1129-1134, July 17–22, 2005

Paper No: IPACK2005-73110

DOI: https://doi.org/10.1115/IPACK2005-73110

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Topics: Stress, Electronic packages, Finite element methods, Resins, Semiconductors (Materials), Temperature, Elastic analysis, Failure, Gages, Numerical analysis

Proceedings Papers

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Toru Ikeda, Won-Keun Kim, Noriyuki Miyazaki

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1167-1175, July 17–22, 2005

Paper No: IPACK2005-73153

DOI: https://doi.org/10.1115/IPACK2005-73153

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Topics: Bonding, Delamination, Flip-chip packages, Reflow soldering, Flip-chip, Flip-chip devices, Reliability, Fracture (Materials), Solder joints, Stress

Proceedings Papers

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

Won-Keun Kim, Toru Ikeda, Noriyuki Miyazaki

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 741-747, July 6–11, 2003

Paper No: IPACK2003-35093

DOI: https://doi.org/10.1115/IPACK2003-35093

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Topics: Flip-chip, Flip-chip devices, Fracture (Materials), Reliability, Stress, Electronic packages, Packaging, Adhesives, Anisotropy, Delamination

Proceedings Papers

Stress Intensity Factor Analyses of Interface Cracks Between Anisotropic Media in Electronic Packages

Toru Ikeda, Koh Yamanaga, Noriyuki Miyazaki

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 791-798, July 6–11, 2003

Paper No: IPACK2003-35146

DOI: https://doi.org/10.1115/IPACK2003-35146

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Topics: Anisotropy, Electronic packages, Fracture (Materials), Stress, Delamination, Finite element methods, Numerical analysis, Plane strain, Composite materials, Crystals

Journal Articles

Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints

Deok-Bo Lee, Toru Ikeda, Noriyuki Miyazaki, Nak-Sam Choi

J. Eng. Mater. Technol. January 2004, 126(1): 14–18.

DOI: https://doi.org/10.1115/1.1631433

Published Online: January 22, 2004

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Topics: Adhesive joints, Adhesives, Fracture (Materials), Fracture toughness, Rubber, Damage, Epoxy resins, Stress, Particulate matter

Journal Articles

Estimation of Steady-State Creep Behavior of Al 2 O 3 / YAG Eutectic Composite by Image-Based Finite Element Analysis

Noriyuki Miyazaki, Toru Ikeda, Toshihiro Komura

J. Eng. Mater. Technol. July 2003, 125(3): 277–282.

DOI: https://doi.org/10.1115/1.1555657

Published Online: July 10, 2003

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Topics: Composite materials, Creep, Crystals, Finite element analysis, Steady state, Constitutive equations

Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato

J. Electron. Packag. March 2003, 125(1): 31–38.

DOI: https://doi.org/10.1115/1.1525244

Published Online: March 14, 2003

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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods

Journal Articles

Damage Zone Around Tip of an Interface Crack Between Rubber-Modified Epoxy Resin and Aluminum

Deok-Bo Lee, Toru Ikeda, Noriyuki Miyazaki, Nak-Sam Choi

J. Eng. Mater. Technol. April 2002, 124(2): 206–214.

DOI: https://doi.org/10.1115/1.1417980

Published Online: March 26, 2002

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Topics: Aluminum, Epoxy resins, Fracture (Materials), Rubber, Stress, Damage, Particulate matter

Journal citation

NARROW

Special Section on InterPACK 2015

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Hygromechanical Analysis of Liquid Crystal Display Panels

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Hygro-Mechanical Analysis of LCD Panels

Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process

Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet

Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

Experimental and Numerical Evaluation of Residual Stress in IC Chips

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

Stress Intensity Factor Analyses of Interface Cracks Between Anisotropic Media in Electronic Packages

Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints

Estimation of Steady-State Creep Behavior of Al 2 O 3 / YAG Eutectic Composite by Image-Based Finite Element Analysis

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Damage Zone Around Tip of an Interface Crack Between Rubber-Modified Epoxy Resin and Aluminum

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