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Todd Salamon
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
Published Online: November 22, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 27–29, 2020
Paper No: IPACK2020-2553
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
Journal Articles
Article Type: Research-Article
J. Heat Transfer. January 2014, 136(1): 012402.
Paper No: HT-12-1493
Published Online: October 17, 2013
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Paper No: InterPACK2009-89269
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 93-105, July 8–12, 2007
Paper No: HT2007-32823
Proceedings Papers

Proc. ASME. ICNMM2006, ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B, 599-609, June 19–21, 2006
Paper No: ICNMM2006-96134
Proceedings Papers

Proc. ASME. IMECE2005, Heat Transfer, Part A, 819-829, November 5–11, 2005
Paper No: IMECE2005-82641