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Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001

Paper No: IMECE2001/HTD-24382

DOI: https://doi.org/10.1115/IMECE2001/HTD-24382

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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability

Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001

Paper No: IMECE2001/HTD-24381

DOI: https://doi.org/10.1115/IMECE2001/HTD-24381

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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation

Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001

Paper No: IMECE2001/HTD-24389

DOI: https://doi.org/10.1115/IMECE2001/HTD-24389

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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software

Proceedings Papers

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 453-459, November 5–10, 2000

Paper No: IMECE2000-1840

DOI: https://doi.org/10.1115/IMECE2000-1840

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Topics: Anisotropy, Manufacturing, Thermal analysis, Transients (Dynamics), Temperature, Computational fluid dynamics, Hardening (Curing), Convection, Cooling, Heat conduction

Proceedings Papers

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Dave S. Mahadevan, Vern Hause, Tien-Yu Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 467-471, November 5–10, 2000

Paper No: IMECE2000-1842

DOI: https://doi.org/10.1115/IMECE2000-1842

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Topics: Bonding, Temperature, Wire, Stress, Elongation, Extruding, Strength (Materials)

Proceedings Papers

Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications

Tien-Yu Tom Lee, Victor A. Chiriac

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 671-677, July 8–12, 2007

Paper No: IPACK2007-33844

DOI: https://doi.org/10.1115/IPACK2007-33844

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Topics: Gallium arsenide, Wire, Flip-chip, Flip-chip devices, Simulation, Design, Heat, Heat transfer, Solders, Vehicles

Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007

Paper No: IPACK2007-33335

DOI: https://doi.org/10.1115/IPACK2007-33335

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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation

Proceedings Papers

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007

Paper No: IPACK2007-33705

DOI: https://doi.org/10.1115/IPACK2007-33705

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Topics: Computer simulation, Heat, Performance evaluation, Transients (Dynamics), Cycles, Heat budget (Physics), Signals, Copper, Design, Dynamic systems

Proceedings Papers

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007

Paper No: IPACK2007-33707

DOI: https://doi.org/10.1115/IPACK2007-33707

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Topics: Lightning, Optimization, Energy dissipation, Temperature, Design, Pins (Engineering), Heat, Heat budget (Physics), Junctions, Automotive industry

Proceedings Papers

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

Tien-Yu Tom Lee, Victor A. Chiriac, Roger Stout

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 105-112, July 17–22, 2005

Paper No: IPACK2005-73090

DOI: https://doi.org/10.1115/IPACK2005-73090

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Topics: Telecommunications, Transients (Dynamics), Cycles, Steady state, Temperature, Waves, Junctions, Capacitors, Computation, Computer software

Proceedings Papers

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee, H. S. Chen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 435-442, July 6–11, 2003

Paper No: IPACK2003-35213

DOI: https://doi.org/10.1115/IPACK2003-35213

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Topics: Microelectronic devices, Optimization, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Computer software, Cooling, Flow (Dynamics)

Proceedings Papers

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 443-450, July 6–11, 2003

Paper No: IPACK2003-35216

DOI: https://doi.org/10.1115/IPACK2003-35216

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Topics: Optimization, Temperature, Elastomers, Design, Slug flows, Computer software, Copper, Failure, High temperature, Numerical analysis

Proceedings Papers

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Patrick E. Phelan, Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 309-315, July 6–11, 2003

Paper No: IPACK2003-35140

DOI: https://doi.org/10.1115/IPACK2003-35140

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Topics: Electronic packaging, Refrigeration, Compression, Vapors, Compressors, Cycles, Microelectronic devices, Thermoelectric coolers

Proceedings Papers

Thermal Assessment of a Power Amplifier Module in Wireless Handsets

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 161-168, November 17–22, 2002

Paper No: IMECE2002-39179

DOI: https://doi.org/10.1115/IMECE2002-39179

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Topics: Computer simulation, Computer software, Copper, Design, Errors, Heat, Heat sinks, Numerical analysis, Optimization, Packaging

Proceedings Papers

Transient Thermal Investigation for a SmartMOS Based Airbag Circuit Driver

Victor Adrian Chiriac, Tien-Yu Tom Lee, Paul Bennett

Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 181-188, November 17–22, 2002

Paper No: IMECE2002-39531

DOI: https://doi.org/10.1115/IMECE2002-39531

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Topics: Airbags, Circuits, Transients (Dynamics), Temperature, Boundary-value problems, Junctions, Computer software, Energy dissipation, Engineering simulation, Heat

Proceedings Papers

Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien-Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 171-178, November 17–22, 2002

Paper No: IMECE2002-39243

DOI: https://doi.org/10.1115/IMECE2002-39243

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Topics: Air jets, Cooling, Heat transfer, Jets, Flow (Dynamics), Temperature, Flat heat pipes, Heat sinks, Manufacturing, Microelectronic devices

Journal citation

NARROW

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Design Analysis of an Electroless Plating Bath Using CFD Technique

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Thermal Assessment of a Power Amplifier Module in Wireless Handsets

Transient Thermal Investigation for a SmartMOS Based Airbag Circuit Driver

Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

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