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Proceedings Papers

An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices

V. H. Adams, T.-Y. Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 151-162, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24388
https://doi.org/10.1115/IMECE2001/HTD-24388
View Paper titled, An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices
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Topics: Gallium arsenide, Wire, Design, Engineering simulation, Junctions, Printed circuit boards, Simulation, Thermal resistance, Epoxy adhesives, Epoxy resins
Proceedings Papers

Thermal Evaluation of GaAs-Based RF Power Amplifier Packages for Handheld Portable Applications

V. H. Adams, T. Y. Tom Lee, J. V. Hause
Proc. ASME. IMECE2000, Manufacturing Engineering, 413-423, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1836
https://doi.org/10.1115/IMECE2000-1836
View Paper titled, Thermal Evaluation of GaAs-Based RF Power Amplifier Packages for Handheld Portable Applications
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Topics: Gallium arsenide, Printed circuit boards, Thermal conductivity, Approximation, Cooling, Energy dissipation, Heat, Heat conduction, Heat flux, Heat transfer
Proceedings Papers

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

V. H. Adams, V. A. Chiriac, T.-Y. Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 433-442, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1838
https://doi.org/10.1115/IMECE2000-1838
View Paper titled, Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications
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Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Cooling, Copper, Design, Energy dissipation, Engineering simulation, Flat heat pipes, Heat, Heat conduction
Proceedings Papers

An Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages

K. Ramakrishna, T.-Y. Tom Lee
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 709-719, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42397
https://doi.org/10.1115/IMECE2003-42397
View Paper titled, An Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages
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Topics: Ball-Grid-Array packaging, Flat heat pipes, Thermal conductivity, Printed circuit boards, Thermal resistance, Junctions, Ceramics, Computational fluid dynamics, Copper, Design
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 135–140.
https://doi.org/10.1115/1.2792599
Published Online: June 1, 1998
View Article titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool
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Topics: Carbon, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption
Journal Articles

Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures

T. Y. Tom Lee, Mali Mahalingam, Peter J. C. Normington
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1993, 115(1): 134–137.
https://doi.org/10.1115/1.2909294
Published Online: March 1, 1993
View Article titled, Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures
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Topics: Critical heat flux, Dielectric liquids, Pool boiling, Subcooling, Boiling, Data collection, Phase transition temperature, Temperature