1-3 of 3
T. F. Guo
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Role of Vapor Pressure on Popcorn Cracking in IC Packages

W. H. Wong, T. F. Guo, L. Cheng
Journal: Materials Performance and Characterization
Publisher: ASTM International
Article Type: Research-Article
Matls. Perf. Charact.. November 2014, 3(3): 542–563.
Paper No: MPC20130044
https://doi.org/10.1520/MPC20130044
Published Online: September 20, 2014
View Article titled, Role of Vapor Pressure on Popcorn Cracking in IC Packages
Open the PDF for Role of Vapor Pressure on Popcorn Cracking in IC Packages in another window
Proceedings Papers

Vapor Pressure Assisted Interface Delamination and Failure of Plastic IC Packages: A Micromechanics Approach

C. W. Chong, T. F. Guo, L. Cheng
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 391-397, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35180
https://doi.org/10.1115/IPACK2003-35180
View Paper titled, Vapor Pressure Assisted Interface Delamination and Failure of Plastic IC Packages: A Micromechanics Approach
Open the PDF for Vapor Pressure Assisted Interface Delamination and Failure of Plastic IC Packages: A Micromechanics Approach in another window
Topics: Damage, Delamination, Failure, Micromechanics (Engineering), Vapor pressure
Journal Articles

An Alternative Decomposition of the Strain Gradient Tensor

H. Jiang, Y. Huang, T. F. Guo, K. C. Hwang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. March 2002, 69(2): 139–141.
https://doi.org/10.1115/1.1430666
Published Online: July 18, 2001
View Article titled, An Alternative Decomposition of the Strain Gradient Tensor
Open the PDF for An Alternative Decomposition of the Strain Gradient Tensor in another window
Topics: Fracture (Materials), Plasticity, Strain gradient, Stress, Tensors, Deformation