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1-20 of 52
Suresh K. Sitaraman
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
Published Online: January 11, 2023
Proceedings Papers
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 73-82, November 11–16, 2001
Paper No: IMECE2001/EPP-24709
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 51-62, November 5–10, 2000
Paper No: IMECE2000-2246
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011009.
Paper No: EP-20-1126
Published Online: August 6, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
Published Online: March 9, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021001.
Paper No: EP-19-1032
Published Online: February 3, 2020
Journal Articles
Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
Published Online: August 25, 2017
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Paper No: IPACK2015-48447
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
Published Online: October 12, 2015
Proceedings Papers
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A041, November 14–20, 2014
Paper No: IMECE2014-40154
Proceedings Papers
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A042, November 14–20, 2014
Paper No: IMECE2014-40041
Proceedings Papers
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014
Paper No: IMECE2014-40199
Proceedings Papers
Proc. ASME. IMECE2014, Volume 5: Education and Globalization, V005T05A039, November 14–20, 2014
Paper No: IMECE2014-40039
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031004.
Paper No: EP-12-1102
Published Online: June 4, 2013
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 903-910, November 11–17, 2011
Paper No: IMECE2011-65767
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 479-485, November 12–18, 2010
Paper No: IMECE2010-38376
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 497-506, November 12–18, 2010
Paper No: IMECE2010-39283
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021014.
Published Online: April 28, 2009
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1669-1677, July 17–22, 2005
Paper No: IPACK2005-73495