Search Results | ASME Digital Collection

1-20 of 52

2 3

Sort by

Sort Order Select

Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman

J. Electron. Packag. September 2023, 145(3): 031004.

Paper No: EP-22-1072

DOI: https://doi.org/10.1115/1.4056530

Published Online: January 11, 2023

View Article

Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging

Proceedings Papers

Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Raghuram V. Pucha, Gnyaneshwar Ramakrishna, Suresh K. Sitaraman

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 73-82, November 11–16, 2001

Paper No: IMECE2001/EPP-24709

DOI: https://doi.org/10.1115/IMECE2001/EPP-24709

View Paper

Topics: Cycles, Deformation, Electronic packages, Electronic packaging, Fatigue, Fatigue life, Materials properties, Microscale devices, Modeling, Plasticity

Proceedings Papers

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications

Rajiv Raghunathan, Raghuram V. Pucha, Suresh K. Sitaraman

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 51-62, November 5–10, 2000

Paper No: IMECE2000-2246

DOI: https://doi.org/10.1115/IMECE2000-2246

View Paper

Topics: Computers, Medical devices, Flip-chip, Manufacturing, Automotive industry, Cycles, Damage, Density, Fatigue damage, Solders

Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

J. Electron. Packag. March 2022, 144(1): 011009.

Paper No: EP-20-1126

DOI: https://doi.org/10.1115/1.4050898

Published Online: August 6, 2021

View Article

Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density

Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021007.

Paper No: EP-19-1085

DOI: https://doi.org/10.1115/1.4046163

Published Online: March 9, 2020

View Article

Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties

Journal Articles

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021001.

Paper No: EP-19-1032

DOI: https://doi.org/10.1115/1.4045706

Published Online: February 3, 2020

View Article

Topics: Failure, Fracture (Materials), Fracture (Process), Delamination, Cantilevers

Journal Articles

Determination of Energy Release Rate Through Sequential Crack Extension

Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman

J. Electron. Packag. December 2017, 139(4): 041003.

Paper No: EP-17-1033

DOI: https://doi.org/10.1115/1.4037334

Published Online: August 25, 2017

View Article

Topics: Fracture (Materials), Thin films, Copper

Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015

Paper No: IPACK2015-48447

DOI: https://doi.org/10.1115/IPACK2015-48447

View Paper

Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement

Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman

J. Electron. Packag. December 2015, 137(4): 041005.

Paper No: EP-14-1064

DOI: https://doi.org/10.1115/1.4031680

Published Online: October 12, 2015

View Article

Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes

Proceedings Papers

Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist

Wei Chen, Yaqin Song, Jiaxing Liang, Suresh K. Sitaraman

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A041, November 14–20, 2014

Paper No: IMECE2014-40154

DOI: https://doi.org/10.1115/IMECE2014-40154

View Paper

Topics: Manufacturing, Photoresists, Design, Semiconductor wafers, Silicon, Displacement, Liquid films, Stress

Proceedings Papers

Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors

Christine Taylor, Xi Liu, Suresh K. Sitaraman

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A042, November 14–20, 2014

Paper No: IMECE2014-40041

DOI: https://doi.org/10.1115/IMECE2014-40041

View Paper

Topics: Metals, Sensors, Silicon, Stress, Packaging, Energy consumption, Engineering simulation, Finite element analysis, Gages, High temperature

Proceedings Papers

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014

Paper No: IMECE2014-40199

DOI: https://doi.org/10.1115/IMECE2014-40199

View Paper

Topics: Flip-chip assemblies, Failure, Finite element model, Fracture (Process), Fracture mechanics, Microelectronic devices, Stress, Adhesives, Delamination, Dielectric materials

Proceedings Papers

Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM

Christine Taylor, Suresh K. Sitaraman

Proc. ASME. IMECE2014, Volume 5: Education and Globalization, V005T05A039, November 14–20, 2014

Paper No: IMECE2014-40039

DOI: https://doi.org/10.1115/IMECE2014-40039

View Paper

Topics: Graduate students, Students, Electronic packaging, Nanotechnology, Cracking (Materials), Damage, Electrical engineering, Electronic packages, Engineering disciplines, Fracture (Process)

Journal Articles

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman

J. Electron. Packag. September 2013, 135(3): 031004.

Paper No: EP-12-1102

DOI: https://doi.org/10.1115/1.4024112

Published Online: June 4, 2013

View Article

Topics: Manufacturing, Reliability, Stress, Thermomechanics, Displacement, Semiconductor wafers, Copper, Simulation, Solders

Proceedings Papers

Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages

Xi Liu, Margaret Simmons-Matthews, Kurt P. Wachtler, Suresh K. Sitaraman

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 903-910, November 11–17, 2011

Paper No: IMECE2011-65767

DOI: https://doi.org/10.1115/IMECE2011-65767

View Paper

Topics: Design, Semiconductor wafers, Reliability, Silicon, Thermomechanics, Experimental design, Finite element analysis, Integrated circuits, Packaging, Semiconductor industry

Proceedings Papers

Parallel-Path Compliant Structures as Electrical Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 479-485, November 12–18, 2010

Paper No: IMECE2010-38376

DOI: https://doi.org/10.1115/IMECE2010-38376

View Paper

Topics: Contamination, Design, Dielectric materials, Dimensions, Failure, Fatigue, Flip-chip devices, Fracture (Materials), Manufacturing, Oxidation

Proceedings Papers

Reliable Design of Electroplated Copper Through Silicon Vias

Xi Liu, Qiao Chen, Venkatesh Sundaram, Sriram Muthukumar, Rao R. Tummala, Suresh K. Sitaraman

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 497-506, November 12–18, 2010

Paper No: IMECE2010-39283

DOI: https://doi.org/10.1115/IMECE2010-39283

View Paper

Topics: Copper, Design, Silicon, Stress, Reliability, Manufacturing, Thermomechanics, Cracking (Materials), Deformation, Electroplating

Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman

J. Electron. Packag. June 2010, 132(2): 021004.

DOI: https://doi.org/10.1115/1.4001746

Published Online: June 11, 2010

View Article

Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics

Journal Articles

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Kevin M. Klein, Gregory Ostrowicki, Andrew T. Gewirtz, Suresh K. Sitaraman

J. Electron. Packag. June 2009, 131(2): 021014.

DOI: https://doi.org/10.1115/1.3103937

Published Online: April 28, 2009

View Article

Topics: Cancer, Manufacturing, Microscale devices, Nanoscale phenomena, Proteins, Electron beams, Lithography, Biomaterials

Proceedings Papers

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

Jiantao Zheng, Suresh K. Sitaraman

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1669-1677, July 17–22, 2005

Paper No: IPACK2005-73495

DOI: https://doi.org/10.1115/IPACK2005-73495

View Paper

Topics: Delamination, Fracture toughness, Microscale devices, Nanoscale phenomena, Strips, Thin films

2 3

Journal citation

NARROW

Mandrel Bend Test of Screen-Printed Silver Conductors

Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

Determination of Energy Release Rate Through Sequential Crack Extension

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist

Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages

Parallel-Path Compliant Structures as Electrical Interconnects

Reliable Design of Electroplated Copper Through Silicon Vias

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only