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Sudarshan Hegde
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Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, August 29–September 1, 2017
Paper No: IPACK2017-74021
Journal Articles
Proceedings Papers

Proc. ASME. IDETC-CIE2008, Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems, 895-903, August 3–6, 2008
Paper No: DETC2008-49617