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Proceedings Papers

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A061, July 6–9, 2015

Paper No: IPACK2015-48802

DOI: https://doi.org/10.1115/IPACK2015-48802

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Topics: MOSFET transistors, Relaxation (Physics), Temperature distribution, Simulation, Electric fields, Thermal properties, Heat, Physics, Temperature

Proceedings Papers

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A082, July 6–9, 2015

Paper No: IPACK2015-48205

DOI: https://doi.org/10.1115/IPACK2015-48205

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Topics: Boundary-value problems, Silicon, Temperature, Thermal resistance, Computation, Heat conduction, Heat transfer, Simulation results, Design, Electronic equipment

Proceedings Papers

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A022, July 16–18, 2013

Paper No: IPACK2013-73275

DOI: https://doi.org/10.1115/IPACK2013-73275

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Topics: Computational fluid dynamics, Simulation, Wave soldering, Solders, Computer software, Electronics, Flow (Dynamics), Fluids, Melting, Melting point

Proceedings Papers

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Masaru Ishizuka, Tomoyuki Hatakeyama, Risako Kibushi, Yasushi Nishino, Shinji Nakagawa

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1405-1410, November 9–15, 2012

Paper No: IMECE2012-85581

DOI: https://doi.org/10.1115/IMECE2012-85581

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Topics: Air flow, Computational fluid dynamics, Electronics, Engineering simulation, Simulation, Electronic equipment, Flow (Dynamics), Cooling, Heat, Particulate matter

Proceedings Papers

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

Takashi Fukue, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa, Katsuhiro Koizumi

Proc. ASME. AJK2011, ASME-JSME-KSME 2011 Joint Fluids Engineering Conference: Volume 1, Symposia – Parts A, B, C, and D, 737-745, July 24–29, 2011

Paper No: AJK2011-22054

DOI: https://doi.org/10.1115/AJK2011-22054

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Topics: Cooling, Design, Electronic equipment, Fans, Flow (Dynamics), Pressure, Density, Capacitors, Electronic components, Heat sinks

Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 145-153, November 12–18, 2010

Paper No: IMECE2010-37028

DOI: https://doi.org/10.1115/IMECE2010-37028

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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection

Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011

Paper No: IPACK2011-52168

DOI: https://doi.org/10.1115/IPACK2011-52168

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Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins

Proceedings Papers

Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards

Yuta Nakano, Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Masataka Hirokawa, Toshio Tomimura

Paper No: IPACK2011-52106

DOI: https://doi.org/10.1115/IPACK2011-52106

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Topics: Electrical wires, Printed circuit boards, Thermal conductivity, Copper, Wire, Computational fluid dynamics, Thermal diffusion

Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 547-555, August 8–13, 2010

Paper No: IHTC14-22786

DOI: https://doi.org/10.1115/IHTC14-22786

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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection

Proceedings Papers

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

Takashi Fukue, Masaru Ishizuka, Shinji Nakagawa, Tomoyuki Hatakeyama, Wataru Nakayama

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 657-664, August 8–13, 2010

Paper No: IHTC14-22979

DOI: https://doi.org/10.1115/IHTC14-22979

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Topics: Air flow, Electronic equipment, Heat sinks, Heat transfer, Network analysis, Electrical components, Design, Computational fluid dynamics, Design methodology, Flow (Dynamics)

Proceedings Papers

Measurement Technique of In-Plane Thermal Resistance of PCB

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Yuta Nakano, Masataka Hirokawa, Toshio Tomimura

Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10159, March 13–17, 2011

Paper No: AJTEC2011-44271

DOI: https://doi.org/10.1115/AJTEC2011-44271

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Topics: Thermal resistance, Thermal diffusion, Copper, Electrical wires, Computational fluid dynamics, Design, Temperature distribution, Electronics, Epoxy adhesives, Epoxy resins

Proceedings Papers

Estimation of Cooling Performance of PCM Module by Using CFD Analysis With Enthalpy Porosity Method

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa

Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10224, March 13–17, 2011

Paper No: AJTEC2011-44274

DOI: https://doi.org/10.1115/AJTEC2011-44274

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Topics: Computational fluid dynamics, Cooling, Enthalpy, Porosity, Flow (Dynamics), Electronic equipment, Heat transfer, High temperature, Low temperature, Phase change materials

Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009

Paper No: InterPACK2009-89218

DOI: https://doi.org/10.1115/InterPACK2009-89218

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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation

Proceedings Papers

Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling

Takashi Fukue, Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 479-490, July 19–23, 2009

Paper No: InterPACK2009-89219

DOI: https://doi.org/10.1115/InterPACK2009-89219

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Topics: Computer cooling, Porosity, Vents, Flow (Dynamics), Cooling, Density, Fans, Pressure

Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009

Paper No: InterPACK2009-89052

DOI: https://doi.org/10.1115/InterPACK2009-89052

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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis

Proceedings Papers

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009

Paper No: InterPACK2009-89103

DOI: https://doi.org/10.1115/InterPACK2009-89103

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Topics: Cooling, Dimensions, Electronic equipment, Clearances (Engineering), Copper, Flow (Dynamics), Temperature, Ducts, Particulate matter, Transparency

Proceedings Papers

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

Masaru Ishizuka, Shinji Nakagawa, Tatsuro Yoshida, Wataru Nakayama

Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1471-1478, October 31–November 6, 2008

Paper No: IMECE2008-66091

DOI: https://doi.org/10.1115/IMECE2008-66091

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Topics: Computational fluid dynamics, Flat heat pipes, Network models, Heat, Temperature, Uncertainty, Computation, Corners (Structural elements), Design, Electronic products

Proceedings Papers

Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 713-718, July 8–12, 2007

Paper No: HT2007-32100

DOI: https://doi.org/10.1115/HT2007-32100

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Topics: Electronic equipment, Flow (Dynamics), Plates (structures), Shapes, Experimental design, Reynolds number, Natural convection

Proceedings Papers

Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment

Yasushi Nishino, Ryoji Imai, Shinji Nakagawa, Masaru Ishizuka

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 757-762, July 8–12, 2007

Paper No: HT2007-32723

DOI: https://doi.org/10.1115/HT2007-32723

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Topics: Clearances (Engineering), Cooling, Electronic equipment, Heating, Temperature, Copper, Modeling, Electronic products, Flow (Dynamics), Natural convection

Proceedings Papers

Experimental Study on Thermal Performance of a Forced Air Cooled PBGA Package in the Compact Thin Casing: Effect of Obstacles Placed Inside the Casing

Masaru Ishizuka, Shinji Nakagawa, Katsuhiro Koizumi

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 297-304, November 11–15, 2007

Paper No: IMECE2007-41112

DOI: https://doi.org/10.1115/IMECE2007-41112

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Topics: Computational fluid dynamics, Design, Dynamic light scattering, Engineering simulation, Flow (Dynamics), Heat, Laptop computers, Printed circuit boards, Simulation, Temperature

Journal citation

NARROW

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

Measurement Technique of In-Plane Thermal Resistance of PCB

Estimation of Cooling Performance of PCM Module by Using CFD Analysis With Enthalpy Porosity Method

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment

Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment

Experimental Study on Thermal Performance of a Forced Air Cooled PBGA Package in the Compact Thin Casing: Effect of Obstacles Placed Inside the Casing

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