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Serpil Kocabiyik
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Journal Articles

Spreading Resistance in Multilayered Orthotropic Flux Channels With Different Conductivities in the Three Spatial Directions

Belal Al-Khamaiseh, Yuri S. Muzychka, Serpil Kocabiyik
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2018, 140(7): 071302.
Paper No: HT-17-1227
https://doi.org/10.1115/1.4038712
Published Online: April 6, 2018
View Article titled, Spreading Resistance in Multilayered Orthotropic Flux Channels With Different Conductivities in the Three Spatial Directions
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Topics: Heat, Thermal resistance, Temperature, Boundary-value problems, Electrical conductance
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48051
https://doi.org/10.1115/IPACK2015-48051
View Paper titled, Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Thermal Spreading Resistance in Flux Channel With Arbitrary Heat Convection in the Sink Plane

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. IMECE2014, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A084, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-37364
https://doi.org/10.1115/IMECE2014-37364
View Paper titled, Thermal Spreading Resistance in Flux Channel With Arbitrary Heat Convection in the Sink Plane
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Topics: Boundary-value problems, Convection, Cooling, Design, Engineers, Finite element model, Fourier series, Heat sinks, Heat transfer coefficients, Microelectronic devices
Proceedings Papers

A CFD Study on Film Thickness, Pressure Drop, and Heat Transfer of Slug Flows in Circular Microchannels

Vandad Talimi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T03A005, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21382
https://doi.org/10.1115/ICNMM2014-21382
View Paper titled, A CFD Study on Film Thickness, Pressure Drop, and Heat Transfer of Slug Flows in Circular Microchannels
Open the PDF for A CFD Study on Film Thickness, Pressure Drop, and Heat Transfer of Slug Flows in Circular Microchannels in another window
Topics: Computational fluid dynamics, Film thickness, Heat transfer, Microchannels, Pressure drop, Slug flows, Computer simulation, Engineering simulation, Experimental analysis, Flow (Dynamics)