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Saketh Mahalingam
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Proceedings Papers

A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1341-1346, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73493
https://doi.org/10.1115/IPACK2005-73493
View Paper titled, A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages
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Topics: Delamination, Flip-chip packages, Fracture mechanics, Fatigue, Flip-chip, Flip-chip devices, Solders, Adhesives, Computer simulation, Displacement
Journal Articles

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Saketh Mahalingam, Ananth Prabhakumar, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
https://doi.org/10.1115/1.3010378
Published Online: November 17, 2008
View Article titled, Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
Open the PDF for Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials in another window
Topics: Delamination, Flip-chip assemblies, Flow (Dynamics), Thermal shock, Fracture (Materials), Thermomechanics, Fatigue
Proceedings Papers

Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards

Saketh Mahalingam, Shashikant Hegde, Gnyaneshwar Ramakrishna, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 165-170, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41645
https://doi.org/10.1115/IMECE2003-41645
View Paper titled, Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards
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Topics: Density, Lumber, Reliability, Cracking (Materials), Fracture (Process), Algorithms, Deformation, Design, Dielectric materials, Optimization
Proceedings Papers

Reliability of Underfilled Chip Scale Packages Attached With Heat Sink

Saketh Mahalingam, Ashutosh Joshi, Joseph Lacey, Kunal Goray
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 65-69, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80673
https://doi.org/10.1115/IMECE2005-80673
View Paper titled, Reliability of Underfilled Chip Scale Packages Attached With Heat Sink
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Topics: Heat sinks, Reliability, Adhesives, Ball-Grid-Array packaging, Solder joints, Manufacturing, Operating temperature, Stress
Proceedings Papers

The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 219-224, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83029
https://doi.org/10.1115/IMECE2005-83029
View Paper titled, The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction
Open the PDF for The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction in another window
Topics: Fatigue, Flip-chip, Flip-chip devices, Reliability, Delamination, Flip-chip packages, Solder joints, Computer simulation, Failure, Flow (Dynamics)
Proceedings Papers

Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder

Kunal Goray, Saketh Mahalingam, Amit Shah, Abhijit Dasgupta
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-143, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15561
https://doi.org/10.1115/IMECE2006-15561
View Paper titled, Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder
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Topics: Lead-free solders, Reliability, Testing, Thermal shock, Solders, Ball-Grid-Array packaging, Computer simulation, Electronics, Failure, Failure analysis
Journal Articles

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
https://doi.org/10.1115/1.2386242
Published Online: October 4, 2006
View Article titled, Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
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Topics: Delamination, Fatigue, Fatigue testing, Fracture (Materials), Stress, Thermomechanics, Temperature, Experimental characterization, Fracture (Process), Fracture toughness