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Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022

Paper No: IPACK2022-97429

DOI: https://doi.org/10.1115/IPACK2022-97429

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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer

Proceedings Papers

Single-Phase Immersion Cooling Study of a High-Density Storage System

Saket Karajgikar, Jasper Kidger, Andrew Shaw, Neil Edmunds, Veerendra Mulay

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 25–27, 2022

Paper No: IPACK2022-97490

DOI: https://doi.org/10.1115/IPACK2022-97490

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Topics: Cooling, Density, Storage

Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022

Paper No: IPACK2022-97494

DOI: https://doi.org/10.1115/IPACK2022-97494

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Topics: Cooling, Data centers, Density, Doors, Heat exchangers

Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar

J. Electron. Packag. June 2022, 144(2): 020301.

Paper No: EP-21-1158

DOI: https://doi.org/10.1115/1.4053122

Published Online: January 4, 2022

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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling

Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang

J. Electron. Packag. September 2020, 142(3): 030301.

Paper No: EP-20-1092

DOI: https://doi.org/10.1115/1.4048039

Published Online: August 14, 2020

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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers

Proceedings Papers

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Fahad Mirza, Bharathkrishnan Muralidharan, Poornima Mynampati, Saket Karajgikar, Dereje Agonafer

Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 675-680, November 12–18, 2010

Paper No: IMECE2010-40803

DOI: https://doi.org/10.1115/IMECE2010-40803

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Topics: Electronics, Energy dissipation, Heat, Silicon, Delays, Density, Electronic products, Failure, Insulation, Integrated circuits

Proceedings Papers

Thermal-Aware Power Migration in Many-Core Processors

Avinash Raghu, Saket Karajgikar, Dereje Agonafer, Bahgat Sammakia, Gamal Refai-Ahmed

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 385-392, November 12–18, 2010

Paper No: IMECE2010-40232

DOI: https://doi.org/10.1115/IMECE2010-40232

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Topics: Computation, Cooling, Currents, Design, Junctions, Leakage, Reliability, Temperature, Thermal management

Proceedings Papers

Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers

Venkata Naga Poornima Mynampati, Saket Karajgikar, Ibraheem Sheerah, Dereje Agonafer, Shlomo Novotny, Roger Schmidt

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 405-410, November 12–18, 2010

Paper No: IMECE2010-40659

DOI: https://doi.org/10.1115/IMECE2010-40659

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Topics: Cooling, Data centers, Doors, Heat exchangers, Telecommunications, Heat, Stress, Density, Energy consumption, Thermal analysis

Proceedings Papers

Cooling of Data Centers Using Airside Economizers

Saket Karajgikar, Veerendra Mulay, Dereje Agonafer, Roger Schmidt

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1001-1007, July 19–23, 2009

Paper No: InterPACK2009-89356

DOI: https://doi.org/10.1115/InterPACK2009-89356

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Topics: Cooling, Data centers, Energy consumption, Air conditioners, Computer simulation, Computers, Electronic components, Environmental Protection Agency, Failure, Heat

Proceedings Papers

Mechanical Design Optimization of a Package on Package

Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 177-184, July 19–23, 2009

Paper No: InterPACK2009-89349

DOI: https://doi.org/10.1115/InterPACK2009-89349

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Topics: Design engineering, Optimization, Package on package

Proceedings Papers

Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives

Saket Karajgikar, Veerendra Mulay, Abhilash Menon, Dereje Agonafer, Jiahui Zhang

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 815-820, July 19–23, 2009

Paper No: InterPACK2009-89189

DOI: https://doi.org/10.1115/InterPACK2009-89189

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Topics: Optimization, Flow (Dynamics), Electronic components, Electronics, Low temperature

Proceedings Papers

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 111-118, July 19–23, 2009

Paper No: InterPACK2009-89188

DOI: https://doi.org/10.1115/InterPACK2009-89188

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Topics: Clocks, Computer simulation, Computers, Control equipment, Junctions, Pareto optimization, Product reliability, Temperature, Temperature gradient

Proceedings Papers

Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers

Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Mark Hendrix

Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1469-1475, November 13–19, 2009

Paper No: IMECE2009-13136

DOI: https://doi.org/10.1115/IMECE2009-13136

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Topics: Telecommunications, Thermal management, Thermoelectric coolers, Batteries, Temperature, Air conditioners, Electronics, Heat, Stress, Battery life

Proceedings Papers

Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmad

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 179-184, November 13–19, 2009

Paper No: IMECE2009-11769

DOI: https://doi.org/10.1115/IMECE2009-11769

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Topics: Clocks, Temperature, Computers, Junctions, Control equipment, Numerical analysis, Pareto optimization, Product reliability, Temperature gradient

Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed

J. Electron. Packag. June 2010, 132(2): 021008.

DOI: https://doi.org/10.1115/1.4001852

Published Online: June 25, 2010

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Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines

Proceedings Papers

Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madshusudan Iyengar, Jay Nigen

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 723-731, July 8–12, 2007

Paper No: IPACK2007-33000

DOI: https://doi.org/10.1115/IPACK2007-33000

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Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Ceilings, Computational fluid dynamics, Computers, Design

Proceedings Papers

Bump Electromigration and Back End Design Rules

Vishal Nagaraj, Saket Karajgikar, Dereje Agonafer, Senol Pekin

Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 377-384, November 11–15, 2007

Paper No: IMECE2007-43766

DOI: https://doi.org/10.1115/IMECE2007-43766

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Topics: Design, Electrodiffusion, Flip-chip, Flip-chip devices, Packaging, Temperature, Finite element analysis, Laminates, Ceramics, Current density

Proceedings Papers

Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madhusudan Iyengar

Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 519-526, November 11–15, 2007

Paper No: IMECE2007-43761

DOI: https://doi.org/10.1115/IMECE2007-43761

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Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Computational fluid dynamics, Computers, Storage, Temperature

Proceedings Papers

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

Saket Karajgikar, Wonkee Ahn, Dereje Agonafer

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1187-1192, July 17–22, 2005

Paper No: IPACK2005-73184

DOI: https://doi.org/10.1115/IPACK2005-73184

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Topics: Manufacturing, Printed circuit boards, Warping

Proceedings Papers

The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I — Computational Study

Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer, Roger Schmidt

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 651-656, November 15–21, 2003

Paper No: IMECE2003-42254

DOI: https://doi.org/10.1115/IMECE2003-42254

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Topics: Refrigeration, Sensors, Temperature, Computers, Cooling, Circuits, Design, Electrical resistance, Electronics, Energy dissipation

Journal citation

NARROW

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Single-Phase Immersion Cooling Study of a High-Density Storage System

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Special Issue on InterPACK2020

Special Issue on InterPACK 2019 – Part 1

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Thermal-Aware Power Migration in Many-Core Processors

Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers

Cooling of Data Centers Using Airside Economizers

Mechanical Design Optimization of a Package on Package

Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers

Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Bump Electromigration and Back End Design Rules

Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I — Computational Study

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