1-3 of 3
Sadakazu Takakuwa
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011
Paper No: IPACK2011-52168
DOI: https://doi.org/10.1115/IPACK2011-52168
View Paper
PDF
Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins
Proceedings Papers

Estimation of Cooling Performance of PCM Module by Using CFD Analysis With Enthalpy Porosity Method

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10224, March 13–17, 2011
Paper No: AJTEC2011-44274
DOI: https://doi.org/10.1115/AJTEC2011-44274
View Paper
PDF
Topics: Computational fluid dynamics, Cooling, Enthalpy, Porosity, Flow (Dynamics), Electronic equipment, Heat transfer, High temperature, Low temperature, Phase change materials
Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Paper No: InterPACK2009-89218
DOI: https://doi.org/10.1115/InterPACK2009-89218
View Paper
PDF
Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation