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Sa’d Hamasha
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Journal Articles

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Xin Wei, Abdallah Alakayleh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011008.
Paper No: EP-23-1011
https://doi.org/10.1115/1.4062894
Published Online: July 21, 2023
View Article titled, Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging
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Topics: Alloys, Creep, Stress, Solder joints, Solders
Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
https://doi.org/10.1115/1.4056559
Published Online: January 27, 2023
View Article titled, Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys
Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
https://doi.org/10.1115/1.4055318
Published Online: September 28, 2022
View Article titled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Journal Articles

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
https://doi.org/10.1115/1.4047341
Published Online: June 23, 2020
View Article titled, Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
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Topics: Alloys, Fatigue, Fatigue life, Solder joints, Solders, Stress, Cycles, Energy dissipation, Fatigue properties, Reliability
Proceedings Papers

Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6560
https://doi.org/10.1115/IPACK2019-6560
View Paper titled, Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading
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Topics: Lead-free solders
Proceedings Papers

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6563
https://doi.org/10.1115/IPACK2019-6563
View Paper titled, Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder
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Topics: Cycles, Lead-free solders, Stress-strain curves, Tensile strength, Thermal shock
Proceedings Papers

Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints

Mohd Aminul Hoque, Md Mahmudur Chowdhury, Sa’d Hamasha, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6567
https://doi.org/10.1115/IPACK2019-6567
View Paper titled, Effects of Shear Cycling on the Mechanical Properties of SAC and SAC+X Lead Free Solder Joints
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Topics: Creep, Lead-free solders, Mechanical properties, Nanoindentation, Shear (Mechanics)
Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
https://doi.org/10.1115/1.4043405
Published Online: May 17, 2019
View Article titled, A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8414
https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
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Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Journal Articles

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

Sinan Su, Nianjun Fu, Francy John Akkara, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
https://doi.org/10.1115/1.4040105
Published Online: May 21, 2018
View Article titled, Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
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Topics: Alloys, Fatigue life, Solder joints, Solders, Stress, Temperature, Cycles, Fatigue
Journal Articles

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

Sa'd Hamasha, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021002.
Paper No: EP-15-1128
https://doi.org/10.1115/1.4032881
Published Online: March 23, 2016
View Article titled, Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
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Topics: Cycles, Solder joints, Fatigue life, Stress
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
View Article titled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature