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Proceedings Papers

Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations

Ronggui Yang, Gang Chen
Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 363-366, November 11–16, 2001
Paper No: IMECE2001/HTD-24141
DOI: https://doi.org/10.1115/IMECE2001/HTD-24141
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Topics: Heat conduction, Nanoscale phenomena, Relaxation (Physics), Approximation, Electromagnetic scattering, Heat, Phonons, Radiation scattering, Scattering (Physics), Size effect
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
DOI: https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance
Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040802.
Paper No: EP-16-1067
DOI: https://doi.org/10.1115/1.4034605
Published Online: October 6, 2016
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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers
Proceedings Papers

Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces

Qian Li, Wei Wang, Chris Oshman, Benoit Latour, Chen Li, Victor M. Bright, Yung-Cheng Lee, Ronggui Yang
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 633-640, November 11–17, 2011
Paper No: IMECE2011-64921
DOI: https://doi.org/10.1115/IMECE2011-64921
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Topics: Columns (Structural), Critical heat flux, Heat transfer coefficients, Nanostructures , Nanowires, Pool boiling
Proceedings Papers

Enhancing Flow Boiling Heat Transfer in Microchannels Using Monolithically-Coated Silicon Nanowires

Dan Li, Gensheng Wu, Wei Wang, Yunda Wang, Ronggui Yang
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 641-642, November 11–17, 2011
Paper No: IMECE2011-64922
DOI: https://doi.org/10.1115/IMECE2011-64922
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Nanowires, Silicon, Critical heat flux, Coating processes, Coatings, Flow instability
Proceedings Papers

Flat Polymer Heat Spreader With High Aspect Ratio Micro Hybrid Wick Operating Under Adverse Gravity

Christopher Oshman, Qian Li, Li-Anne Liew, Ronggui Yang, Y. C. Lee, Victor M. Bright
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 601-606, November 11–17, 2011
Paper No: IMECE2011-64264
DOI: https://doi.org/10.1115/IMECE2011-64264
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Topics: Flat heat pipes, Gravity (Force), Polymers, Copper, Thermal resistance, Columns (Structural), Heat flux, Heat transfer, Condensation, Condensers (steam plant)
Proceedings Papers

Thermal Transport Across Carbon Nanotube Connected by Molecular Linkers

Jun Liu, Mohamed Alhashme, Ronggui Yang
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 395-396, November 11–17, 2011
Paper No: IMECE2011-64931
DOI: https://doi.org/10.1115/IMECE2011-64931
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Topics: Carbon nanotubes, Thermal conductivity, Density, Mechanical properties, Molecular dynamics
Proceedings Papers

Characterization of Hybrid-Wicked Copper Heat Pipe

Xianming Dai, Levey Tran, Fanghao Yang, Bo Shi, Ronggui Yang, Y. C. Lee, Chen Li
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30005, March 13–17, 2011
Paper No: AJTEC2011-44088
DOI: https://doi.org/10.1115/AJTEC2011-44088
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Topics: Copper, Heat pipes, Thermal conductivity, Electronics, Flat heat pipes, Heat flux, Computer cooling, Cooling, Design, Electronic packages
Proceedings Papers

Frequency-Domain Thermoreflectance Technique for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films

Jie Zhu, Dawei Tang, Wei Wang, Jun Liu, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 371-379, August 8–13, 2010
Paper No: IHTC14-22522
DOI: https://doi.org/10.1115/IHTC14-22522
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Topics: Thermal conductivity, Thermoreflectance, Thin films, Quartz, Signals, Fittings, Geometry, Heat, Metals, Nanomaterials
Proceedings Papers

Tuning Thermal Conductivity With Mechanical Strain

Xiaobo Li, Jun Liu, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 551-558, August 8–13, 2010
Paper No: IHTC14-23334
DOI: https://doi.org/10.1115/IHTC14-23334
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Topics: Thermal conductivity, Carbon, Silicon, Graphene, Nanowires, Polymers, Single-walled carbon nanotubes, Thin films, Buckling, Chain
Proceedings Papers

Enhancement of Heat Transfer With Pool and Spray Impingement Boiling on Microporous and Nanowire Surface Coatings

Suraj Joottu Thiagarajan, Sreekant Narumanchi, Charles King, Wei Wang, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 819-828, August 8–13, 2010
Paper No: IHTC14-23284
DOI: https://doi.org/10.1115/IHTC14-23284
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Topics: Boiling, Coatings, Cooling, Heat transfer, Nanowires, Sprays
Proceedings Papers

Thermal Conductivity of High Contrast Nanoparticle Composites

Weixue Tian, Ronggui Yang
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 1-6, July 8–12, 2007
Paper No: HT2007-32120
DOI: https://doi.org/10.1115/HT2007-32120
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Topics: Composite materials, Nanoparticles, Thermal conductivity, Nanocomposites, Phonons, Percolation theory, Thermal resistance, Electromagnetic scattering, Mean free path, Particle size
Proceedings Papers

Curvature Effect on the Thermal Conductivity of Nanowires

Liang-Chun Liu, Mei-Jiau Huang, Ronggui Yang
Proc. ASME. HT2008, Heat Transfer: Volume 1, 369-372, August 10–14, 2008
Paper No: HT2008-56339
DOI: https://doi.org/10.1115/HT2008-56339
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Topics: Nanowires, Thermal conductivity, Phonons, Geometry, Nanostructures , Preferences, Silicon, Wire
Proceedings Papers

Thermal Conductivity of Core-Shell Nanostructures: From Nanowires to Nanocomposites

Ronggui Yang, Gang Chen, Mildred S. Dresselhaus
Proc. ASME. HT2005, Heat Transfer: Volume 4, 895-901, July 17–22, 2005
Paper No: HT2005-72198
DOI: https://doi.org/10.1115/HT2005-72198
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Topics: Nanocomposites, Nanoporous materials, Nanostructures , Nanowires, Phonons, Shells, Thermal conductivity
Proceedings Papers

Monte Carlo Simulation of the Thermal Conductivity and Phonon Transport in Nanocomposites

Ming-Shan Jeng, Ronggui Yang, David Song, Gang Chen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2207-2215, July 17–22, 2005
Paper No: IPACK2005-73494
DOI: https://doi.org/10.1115/IPACK2005-73494
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Topics: Nanocomposites, Phonons, Simulation, Thermal conductivity
Proceedings Papers

Thermal Conductivity Prediction of Periodic Nanocomposites Using Phonon Boltzmann Equation

Ronggui Yang, Gang Chen
Proc. ASME. HT-FED2004, Volume 4, 449-456, July 11–15, 2004
Paper No: HT-FED2004-56460
DOI: https://doi.org/10.1115/HT-FED2004-56460
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Topics: Nanocomposites, Phonons, Superlattices, Thermal conductivity
Proceedings Papers

Pump-Probe Experimental Study of Phonon Reflectivity at an Interface and Phonon Relaxation Time

Ronggui Yang, Xiaoyuan Chen, Aaron Schmidt, Gang Chen
Proc. ASME. NANO2005, Design, Synthesis, and Applications, 55-56, September 12–14, 2005
Paper No: NANO2005-87064
DOI: https://doi.org/10.1115/NANO2005-87064
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Topics: Phonons, Probes, Pumps, Reflectance, Relaxation (Physics), Nanostructures , Electrons, Energy conversion, Engineering simulation, Heat transfer
Proceedings Papers

Nano-to-Macroscale Transport Modeling Through Approximations

Gang Chen, Ronggui Yang
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 61-68, November 17–22, 2002
Paper No: IMECE2002-32120
DOI: https://doi.org/10.1115/IMECE2002-32120
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Topics: Approximation, Diffusion (Physics), Modeling, Phonons, Heat, Thermoelectric devices, Cooling, Electron transport, Electrons, Energy conversion
Journal Articles

Modeling the Thermal Conductivity and Phonon Transport in Nanoparticle Composites Using Monte Carlo Simulation

Ming-Shan Jeng, Ronggui Yang, David Song, Gang Chen
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. April 2008, 130(4): 042410.
DOI: https://doi.org/10.1115/1.2818765
Published Online: March 19, 2008
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Topics: Composite materials, Nanocomposites, Nanoparticles, Phonons, Simulation, Thermal conductivity, Electromagnetic scattering, Temperature, Boundary-value problems, Particulate matter
Journal Articles

Simulation of Nanoscale Multidimensional Transient Heat Conduction Problems Using Ballistic-Diffusive Equations and Phonon Boltzmann Equation

Ronggui Yang, Mem. ASME, Gang Chen, Mem. ASME, Marine Laroche, Yuan Taur
Journal: Journal of Heat Transfer
Article Type: Technical Papers
J. Heat Transfer. March 2005, 127(3): 298–306.
DOI: https://doi.org/10.1115/1.1857941
Published Online: March 24, 2005
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Topics: Boundary-value problems, Heat, Nanoscale phenomena, Phonons, Temperature, Transients (Dynamics), Heat conduction, Simulation, Equilibrium (Physics), Relaxation (Physics)