Search Results | ASME Digital Collection

1-20 of 28

Sort by

Sort Order Select

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

View Paper

Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Die Stress Measurements Using High Temperature Die-Attachment Materials

Yida Zou, Jeffrey C. Suhling, Richard C. Jaeger, Shun-Tien Lin, Jeffrey T. Benoit, Richard R. Grzybowski

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 107-117, November 15–20, 1998

Paper No: IMECE1998-0436

DOI: https://doi.org/10.1115/IMECE1998-0436

View Paper

Topics: High temperature, Stress, Temperature, Adhesives, Sensors, Ceramics, Engineering simulation, Finite element analysis, Glass, Packaging

Proceedings Papers

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 27–30, 2018

Paper No: IPACK2018-8219

DOI: https://doi.org/10.1115/IPACK2018-8219

View Paper

Topics: Calibration, Design, Sensors, Silicon, Stress, Resistors, Temperature, Aerospace systems, Drilling, Geothermal power stations

Journal Articles

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Richard C. Jaeger, Jeffrey C. Suhling, Jun Chen

J. Electron. Packag. December 2018, 140(4): 044501.

Paper No: EP-18-1013

DOI: https://doi.org/10.1115/1.4040829

Published Online: August 3, 2018

View Article

Topics: Sensors, Stress

Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. March 2018, 140(1): 017001.

Paper No: EP-17-1111

DOI: https://doi.org/10.1115/1.4038735

Published Online: March 2, 2018

View Article

Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire

Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017

Paper No: IPACK2017-74273

DOI: https://doi.org/10.1115/IPACK2017-74273

View Paper

Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)

Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015

Paper No: IPACK2015-48626

DOI: https://doi.org/10.1115/IPACK2015-48626

View Paper

Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption

Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger

Paper No: IPACK2015-48627

DOI: https://doi.org/10.1115/IPACK2015-48627

View Paper

Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis

Journal Articles

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. December 2014, 136(4): 041014.

Paper No: EP-14-1027

DOI: https://doi.org/10.1115/1.4028333

Published Online: September 19, 2014

View Article

Topics: Sensors, Silicon, Stress, Bridges (Structures), Shear stress

Proceedings Papers

The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors

Safina Hussain, Parameshwaran Gnanachchelvi, Jeffrey C. Suhling, Richard C. Jaeger, Michael C. Hamilton, Bogdan M. Wilamowski

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A010, July 16–18, 2013

Paper No: IPACK2013-73233

DOI: https://doi.org/10.1115/IPACK2013-73233

View Paper

Topics: Stress, Transistors

Proceedings Papers

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Paper No: IPACK2013-73244

DOI: https://doi.org/10.1115/IPACK2013-73244

View Paper

Topics: Flip-chip, Flip-chip devices, Manufacturing, Sensors, Stress

Proceedings Papers

Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

Paper No: IPACK2013-73249

DOI: https://doi.org/10.1115/IPACK2013-73249

View Paper

Topics: Bridges (Structures), Sensors, Silicon, Stress, Wire

Journal Articles

Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

J. Electron. Packag. September 2012, 134(3): 031005.

DOI: https://doi.org/10.1115/1.4006910

Published Online: July 18, 2012

View Article

Topics: Stress, Manufacturing, Packaging, Sensors, Heat sinks

Proceedings Papers

Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 493-506, July 6–8, 2011

Paper No: IPACK2011-52185

DOI: https://doi.org/10.1115/IPACK2011-52185

View Paper

Topics: Heat sinks, Manufacturing, Packaging, Sensors, Stress

Proceedings Papers

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 15-25, July 19–23, 2009

Paper No: InterPACK2009-89245

DOI: https://doi.org/10.1115/InterPACK2009-89245

View Paper

Topics: Errors, Flip-chip packages, Sensors, Silicon, Stress, Temperature, Integrated circuits, Electronic packages, Finite element model, Flip-chip

Proceedings Papers

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Jordan Roberts, M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Ron Zhang

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 977-988, July 19–23, 2009

Paper No: InterPACK2009-89383

DOI: https://doi.org/10.1115/InterPACK2009-89383

View Paper

Topics: Flip-chip, Flip-chip devices, Packaging, Stress, Sensors, Ceramics, Adhesives, Cycles, Manufacturing, Silicon

Proceedings Papers

Stresses in Area Array Assemblies Subjected to Thermal Cycling

Jordan Roberts, M. Kaysar Rahim, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 267-278, November 13–19, 2009

Paper No: IMECE2009-11925

DOI: https://doi.org/10.1115/IMECE2009-11925

View Paper

Topics: Stress, Temperature, Ball-Grid-Array packaging, Cycles, Sensors, Constitutive equations, Finite element analysis, Flip-chip, Flip-chip devices, Packaging

Proceedings Papers

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 451-464, July 8–12, 2007

Paper No: IPACK2007-33053

DOI: https://doi.org/10.1115/IPACK2007-33053

View Paper

Topics: Silicon, Stress, Temperature, Sensors, Anisotropy, Calibration, Chemical etching, Electrical resistivity, Electron mobility, Engineering simulation

Proceedings Papers

Die Stress Variation During Thermal Cycling Reliability Tests

M. Kaysar Rahim, Jordan Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 481-492, July 8–12, 2007

Paper No: IPACK2007-33548

DOI: https://doi.org/10.1115/IPACK2007-33548

View Paper

Topics: Reliability, Stress, Sensors, Temperature, Cycles, Packaging, Electronic packaging, Solders, Accelerated life testing, Constitutive equations

Proceedings Papers

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Yonggang Chen, Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 285-295, July 8–12, 2007

Paper No: IPACK2007-33569

DOI: https://doi.org/10.1115/IPACK2007-33569

View Paper

Topics: Complementary metal oxide semiconductors, Resolution (Optics), Sensors, Stress, Integrated circuits, Calibration, Cavities, Finite element analysis, Mirrors, Shear stress

Journal citation

NARROW

Advances in Stress Test Chips

Die Stress Measurements Using High Temperature Die-Attachment Materials

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon

Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping

Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Stresses in Area Array Assemblies Subjected to Thermal Cycling

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Die Stress Variation During Thermal Cycling Reliability Tests

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only