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Ray Radebaugh
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Paper No: IPACK2013-73290
Proceedings Papers

Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 501-506, July 8–12, 2012
Paper No: ICNMM2012-73110
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031003.
Paper No: TSEA-12-1031
Published Online: June 24, 2013
Proceedings Papers

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 423-428, November 11–17, 2011
Paper No: IMECE2011-63908
Proceedings Papers

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 181-186, November 11–17, 2011
Paper No: IMECE2011-62513