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R. Wayne Johnson
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Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
DOI: https://doi.org/10.1115/1.4034854
Published Online: October 20, 2016
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Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling
Journal Articles

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
DOI: https://doi.org/10.1115/1.4032462
Published Online: March 10, 2016
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Topics: Alloys, Thermal resistance, Disks, Copper, Wetting, Reliability, Cycles
Proceedings Papers

Thermal Resistance and PIV Characterization of a Line-Replaceable Compact Liquid-Cooled Server Module for High Performance Computing Platforms

Joshua Gess, Sushil H. Bhavnani, R. Wayne Johnson
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A084, November 14–20, 2014
Paper No: IMECE2014-38866
DOI: https://doi.org/10.1115/IMECE2014-38866
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Topics: Thermal resistance, Data centers, Flow (Dynamics), Fluid dynamics, Heat, Condensation, Design, Electronics, Energy consumption, Energy resources
Proceedings Papers

Cooling of High-Performance Server Modules Using Direct Immersion

Aravind Sridhar, Sarah Styslinger, Christopher Duron, Sushil H. Bhavnani, Roy W. Knight, Daniel Harris, R. Wayne Johnson
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 759-765, July 8–12, 2012
Paper No: HT2012-58433
DOI: https://doi.org/10.1115/HT2012-58433
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Topics: Cooling, Heat, Boiling, Flat heat pipes, Heat flux, Temperature, Computer simulation, Copper, Dielectric liquids, Energy dissipation
Proceedings Papers

Drop Reliability of Corner Bonded CSP in Portable Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Jeffrey Suhling, Larry Crane
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 897-905, July 6–11, 2003
Paper No: IPACK2003-35318
DOI: https://doi.org/10.1115/IPACK2003-35318
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Topics: Corners (Structural elements), Reliability, Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills

Saiful Islam, Pradeep Lall, Jeffrey C. Suhling, R. Wayne Johnson
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 27-40, November 15–21, 2003
Paper No: IMECE2003-42083
DOI: https://doi.org/10.1115/IMECE2003-42083
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Topics: Creep, Damage, Fatigue, Fatigue life, Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Machinery, Mechanical testing
Proceedings Papers

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Dhananjay Panchgade, Jeffrey Suhling, Larry Crane
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 135-143, November 15–21, 2003
Paper No: IMECE2003-42075
DOI: https://doi.org/10.1115/IMECE2003-42075
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Topics: Reliability, Corners (Structural elements), Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)