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R. W. Johnson
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Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

R. W. Johnson, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021011.
Paper No: EP-14-1045
https://doi.org/10.1115/1.4029345
Published Online: June 1, 2015
View Article titled, Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack
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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation
Proceedings Papers

Analysis of TSV/Micro-Bump Deformation due to Chip Misalignment and Thermal Processing in 3D IC Packages

R. W. Johnson, Y.-L. Shen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1001-1010, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87728
https://doi.org/10.1115/IMECE2012-87728
View Paper titled, Analysis of TSV/Micro-Bump Deformation due to Chip Misalignment and Thermal Processing in 3D IC Packages
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Topics: Deformation, Shear deformation, Bonding, Silicon chips, Solders, Stress, Thermal expansion, Damage, Finite element model, Integrated circuits
Proceedings Papers

Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints

N. Islam, J. C. Suhling, P. Lall, T. Shete, H. S. Gale, R. W. Johnson, M. J. Bozack, P. Seto, T. Gupta, J. R. Thompson
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 225-228, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42117
https://doi.org/10.1115/IMECE2003-42117
View Paper titled, Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints
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Topics: Lead-free solders, Reliability, Resistors, Solders, Alloys, Fatigue, Solder joints, Temperature
Proceedings Papers

Adiabatic Temperature Rise and Heat Release Rates for Concrete With Application to a Large-Scale Multi-Step Grouting Process

J. E. O’Brien, R. W. Johnson, A. S. Siahpush, C. M. Stoots
Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 93-101, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60116
https://doi.org/10.1115/IMECE2004-60116
View Paper titled, Adiabatic Temperature Rise and Heat Release Rates for Concrete With Application to a Large-Scale Multi-Step Grouting Process
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Topics: Concretes, Grouting, Heat, Temperature, Finite element analysis, Computer simulation, Engineering simulation, Hardening (Curing), Heating, Simulation
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
View Article titled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
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Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits
Journal Articles

Heat Transfer in Laminar Flow Past a Rectangular Cavity With Fluid Injection

R. W. Johnson, A. M. Dhanak
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1976, 98(2): 226–231.
https://doi.org/10.1115/1.3450523
Published Online: May 1, 1976
View Article titled, Heat Transfer in Laminar Flow Past a Rectangular Cavity With Fluid Injection
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Topics: Cavities, Fluids, Heat transfer, Laminar flow, Air flow, Cavity walls, Reynolds number
Journal Articles

Water Electrolysis: Prospect for the Future

T. Wydeven, R. W. Johnson
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. November 1968, 90(4): 531–540.
https://doi.org/10.1115/1.3604685
Published Online: November 1, 1968
View Article titled, Water Electrolysis: Prospect for the Future
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Topics: Electrolysis, Water, Design, Engineering prototypes, Generators, Oxygen, Space vehicles, Testing, Vapors
Journal Articles

Discussion: “The Influence of Redundant Work When Drawing Rods Through Conical Dies” (Caddell, R. M., and Atkins, A. G., 1968, ASME J. Eng. Ind., 90, pp. 411–416)

R. W. Johnson
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Discussions
J. Manuf. Sci. Eng. May 1968, 90(2): 416–417.
https://doi.org/10.1115/1.3604654
Published Online: May 1, 1968
View Article titled, Discussion: “The Influence of Redundant Work When Drawing Rods Through Conical Dies” (Caddell, R. M., and Atkins, A. G., 1968, ASME J. Eng. Ind., 90, pp. 411–416)
Open the PDF for Discussion: “The Influence of Redundant Work When Drawing Rods Through Conical Dies” (Caddell, R. M., and Atkins, A. G., 1968, ASME J. Eng. Ind., 90, pp. 411–416) in another window
Topics: Rods