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Proceedings Papers

3D Printed Food Design and Fabrication Approach for Manufacturability, Rheology, and Nutrition Trade-Offs

Rahmatul Mahmoud, Quang Nguyen, Gordon Christopher, Paul F. Egan
Proc. ASME. IDETC-CIE2021, Volume 3A: 47th Design Automation Conference (DAC), V03AT03A034, August 17–19, 2021
Publisher: American Society of Mechanical Engineers
Paper No: DETC2021-70663
https://doi.org/10.1115/DETC2021-70663
View Paper titled, 3D Printed Food Design and Fabrication Approach for Manufacturability, Rheology, and Nutrition Trade-Offs
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Topics: Additive manufacturing, Design, Food products, Manufacturing, Rheology, Tradeoffs, Biomaterials, Design automation, Design methodology, Printing
Journal Articles

Condensation and Wetting Behavior on Hybrid Superhydrophobic and Superhydrophilic Copper Surfaces

Hai Wang, Quang Nguyen, Jae W. Kwon, Hongbin Ma
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2020, 142(4): 041601.
Paper No: HT-19-1428
https://doi.org/10.1115/1.4046209
Published Online: February 20, 2020
View Article titled, Condensation and Wetting Behavior on Hybrid Superhydrophobic and Superhydrophilic Copper Surfaces
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Topics: Condensation, Copper, Drops, Heat transfer coefficients, Wetting, Film condensation, Water
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Journal Articles

Droplets Jumping from a Hybrid Superhydrophilic and Superhydrophobic Surface

Hai Wang, Quang Nguyen, Jae W. Kwon, Jing Wang, Hongbin Ma
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. February 2017, 139(2): 020908.
Paper No: HT-16-1720
https://doi.org/10.1115/1.4035578
Published Online: January 6, 2017
View Article titled, Droplets Jumping from a Hybrid Superhydrophilic and Superhydrophobic Surface
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Topics: Drops, Condensation, Copper, Film condensation, Nanorods, Sodium, Spin coating, Wetting
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48626
https://doi.org/10.1115/IPACK2015-48626
View Paper titled, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48627
https://doi.org/10.1115/IPACK2015-48627
View Paper titled, Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
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Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis
Proceedings Papers

Validation of Material Constants for Low-Cycle Fatigue Modeling

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39267
https://doi.org/10.1115/IMECE2014-39267
View Paper titled, Validation of Material Constants for Low-Cycle Fatigue Modeling
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Topics: Low cycle fatigue, Modeling, Computer simulation, Electrical resistance, Failure, Fatigue life, Impact modeling, Lumber, Solder joints, Weibull distribution
Proceedings Papers

Effect of Support Friction in Thermal Stress of VVER-1000 RCS for NOP Condition

Truong Quang Nguyen, Ihn Namgung
Proc. ASME. ICONE22, Volume 1: Plant Operations, Maintenance, Engineering, Modifications, Life Cycle and Balance of Plant; Nuclear Fuel and Materials; Plant Systems, Structures and Components; Codes, Standards, Licensing and Regulatory Issues, V001T03A026, July 7–11, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICONE22-30904
https://doi.org/10.1115/ICONE22-30904
View Paper titled, Effect of Support Friction in Thermal Stress of VVER-1000 RCS for NOP Condition
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Topics: Friction, Thermal stresses, Boilers, Reactor vessels, Temperature, Stress, Nozzles, Nuclear reactor coolants, Pumps, Yield stress
Proceedings Papers

Characterization of Crack Growth in BGA Under Drop Impact

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73110
https://doi.org/10.1115/IPACK2013-73110
View Paper titled, Characterization of Crack Growth in BGA Under Drop Impact
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Topics: Ball-Grid-Array packaging, Fracture (Materials), Solder joints, Damage, Imaging, Low cycle fatigue, Microscopes, Polishing, Tin, Vehicles
Journal Articles

Evaluation of Applying Low Calorific Fuel as Reburn Fuel in an Opposed Wall Fired Boiler

Guang Xu, Wei Zhou, Larry W. Swanson, David K. Moyeda, Quang Nguyen
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031007.
https://doi.org/10.1115/1.4000985
Published Online: April 6, 2010
View Article titled, Evaluation of Applying Low Calorific Fuel as Reburn Fuel in an Opposed Wall Fired Boiler
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Topics: Boilers, Fuels, Nitrogen oxides, Coal, Furnaces, Heat