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Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
DOI: https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
DOI: https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
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Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat
Proceedings Papers

Thermal Modeling for High Thermal Conductivity Thermal Ground Planes

Mohammed T. Ababneh, Pramod Chamarthy, Shakti Chauhan, Frank M. Gerner, Peter de Bock, Tao Deng
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 625-634, July 8–12, 2012
Paper No: HT2012-58115
DOI: https://doi.org/10.1115/HT2012-58115
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Topics: Modeling, Thermal conductivity, Heat transfer coefficients, Cooling, Energy budget (Physics), Vapors, Condensation, Evaporation, Finite element model, Flow (Dynamics)
Proceedings Papers

Thermo-Fluid Model for High Thermal Conductivity Thermal Ground Planes

Mohammed T. Ababneh, Frank M. Gerner, Pramod Chamarthy, Peter de Bock, Shakti Chauhan, Tao Deng
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 929-937, March 3–6, 2012
Paper No: MNHMT2012-75185
DOI: https://doi.org/10.1115/MNHMT2012-75185
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Topics: Thermal conductivity, Thermofluids, Heat, Cooling, Gases, Heat pipes, Laminar flow, Microelectronic devices, Porosity, Pressure
Journal Articles

Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane

Mohammed T. Ababneh, Shakti Chauhan, Frank M. Gerner, Doug Hurd, Peter de Bock, Tao Deng
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. February 2013, 135(2): 021401.
Paper No: HT-11-1479
DOI: https://doi.org/10.1115/1.4007430
Published Online: December 28, 2012
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Topics: Calibration, Errors, Evacuations, Fluids, Heat pipes, Pressure, Vacuum, Valves, Water, Heat
Proceedings Papers

Charging Station of a Planar Miniature Thermal Ground Plane

Mohammed T. Ababneh, Frank M. Gerner, Doug Hurd, Peter de Bock, Shakti Chauhan, Tao Deng
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10117, March 13–17, 2011
Paper No: AJTEC2011-44056
DOI: https://doi.org/10.1115/AJTEC2011-44056
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Topics: Calibration, Cooling, Design, Electrodes, Errors, Evacuations, Fluids, Gravity (Force), Heat pipes, Pressure