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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
DOI: https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Journal Articles

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031001.
Paper No: EP-20-1111
DOI: https://doi.org/10.1115/1.4051620
Published Online: September 15, 2021
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Topics: Fatigue, Solder joints, Stiffness, Stress, Temperature, Failure, Deformation, Manufacturing, Shear (Mechanics)
Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
DOI: https://doi.org/10.1115/1.4051728
Published Online: September 15, 2021
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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
DOI: https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate

Arun Raj, Rajesh Sharma Sivasubramony, Manu Yadav, Sanoop Thekkut, Gurvinder Singh Khinda, Mohammed Alhendi, Mark D. Poliks, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021006.
Paper No: EP-19-1125
DOI: https://doi.org/10.1115/1.4048591
Published Online: October 23, 2020
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Topics: Aerosols, Annealing, Fatigue, Inks, Sintering, Temperature, Cycles
Proceedings Papers

Assessing the Geometric Integrity of Additive Manufactured Parts From Point Cloud Data Using Spectral Graph Theoretic Sparse Representation-Based Classification

M. Samie Tootooni, Ashley Dsouza, Ryan Donovan, Prahalad K. Rao, Zhenyu (James) Kong, Peter Borgesen
Proc. ASME. MSEC2017, Volume 2: Additive Manufacturing; Materials, V002T01A042, June 4–8, 2017
Paper No: MSEC2017-2794
DOI: https://doi.org/10.1115/MSEC2017-2794
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Topics: Additive manufacturing, Lasers, Extruding, Temperature, Eigenvalues, Experimental design, Geometric dimensioning and tolerancing, Geometry, Manufacturing, Modeling
Journal Articles

Classifying the Dimensional Variation in Additive Manufactured Parts From Laser-Scanned Three-Dimensional Point Cloud Data Using Machine Learning Approaches

M. Samie Tootooni, Ashley Dsouza, Ryan Donovan, Prahalad K. Rao, Zhenyu (James) Kong, Peter Borgesen
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. September 2017, 139(9): 091005.
Paper No: MANU-17-1073
DOI: https://doi.org/10.1115/1.4036641
Published Online: June 22, 2017
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Topics: Additive manufacturing, Design, Eigenvalues, Lasers, Machine learning
Journal Articles

Computational Fluid Dynamics Modeling and Online Monitoring of Aerosol Jet Printing Process

Roozbeh (Ross) Salary, Jack P. Lombardi, M. Samie Tootooni, Ryan Donovan, Prahalad K. Rao, Peter Borgesen, Mark D. Poliks
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. February 2017, 139(2): 021015.
Paper No: MANU-16-1239
DOI: https://doi.org/10.1115/1.4034591
Published Online: October 3, 2016
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Topics: Aerosols, Computational fluid dynamics, Density, Flow (Dynamics), Gas flow, Modeling, Simulation, Printing, Nozzles, Geometry
Journal Articles

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

Sa'd Hamasha, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021002.
Paper No: EP-15-1128
DOI: https://doi.org/10.1115/1.4032881
Published Online: March 23, 2016
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Topics: Cycles, Solder joints, Fatigue life, Stress
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
DOI: https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Proceedings Papers

Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators

Siyi Zhou, Bahgat G. Sammakia, Bruce White, Peter Borgesen, Cheng Chen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Paper No: IPACK2013-73225
DOI: https://doi.org/10.1115/IPACK2013-73225
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Topics: Energy conversion, Generators, Water, Flow (Dynamics), Heat exchangers, Energy budget (Physics), Energy generation, Finite element analysis, Gages, Heat
Proceedings Papers

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Dustin D’Angelo, S. Manian Ramkumar, Luke Wentlent, Peter Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 475-483, November 9–15, 2012
Paper No: IMECE2012-89655
DOI: https://doi.org/10.1115/IMECE2012-89655
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Topics: Adhesives, Anisotropy, Cycles, Manufacturing, Package on package, Shear (Mechanics), Solders, Reliability, Hardening (Curing), Particulate matter
Journal Articles

Joint Level Test Methods for Solder Pad Cratering Investigations

Brian D. Roggeman, Venkatesh Raghavan, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031007.
DOI: https://doi.org/10.1115/1.4004182
Published Online: September 14, 2011
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Topics: Laminates, Resins, Shear (Mechanics), Solders, Testing, Stress, Failure, Temperature
Proceedings Papers

Recrystallization of Lead Free Solder Joints: Confounding the Interpretation of Accelerated Thermal Cycling Results?

Ahmad Mayyas, Liang Yin, Peter Borgesen
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 319-326, November 13–19, 2009
Paper No: IMECE2009-12749
DOI: https://doi.org/10.1115/IMECE2009-12749
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Topics: Lead-free solders, Recrystallization, Damage, Cracking (Materials), Failure, Fracture (Process), Reliability, Vibration, Ball-Grid-Array packaging, Engineers
Proceedings Papers

Lead-Free Flip Chip Assembly

Sunil Gopakumar, Vinodh Poyyapakkam, Dan Blass, Peter Borgesen, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002
Paper No: IMECE2002-39251
DOI: https://doi.org/10.1115/IMECE2002-39251
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Topics: Alloys, Collapse, Copper, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flux (Metallurgy), Manufacturing, Soldering, Solders
Proceedings Papers

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Muthiah Venkateswaran, Peter Borgesen, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 111-115, November 17–22, 2002
Paper No: IMECE2002-39252
DOI: https://doi.org/10.1115/IMECE2002-39252
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Topics: Adhesives, Flip-chip assemblies
Proceedings Papers

Passive Optoelectronics Component Manufacturing: A Case Study

Laurence A. Harvilchuck, Peter Borgesen, Pericles Kondos, Sunil Gopakumar, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 465-469, November 17–22, 2002
Paper No: IMECE2002-39208
DOI: https://doi.org/10.1115/IMECE2002-39208
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Topics: Manufacturing, Optoelectronic devices
Proceedings Papers

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

Mohammad Yunus, Muthiah Venkateswaran, Peter Borgesen
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 117-123, November 17–22, 2002
Paper No: IMECE2002-39253
DOI: https://doi.org/10.1115/IMECE2002-39253
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Topics: Alloys, Flip-chip, Flip-chip devices, Lead-free solders, Tin, Solders, Alpha particles, Ceramics, Copper alloys, Electronic products
Proceedings Papers

A Study on Optical Fiber Damage Due to Optoelectronic Assembly Processes

Kaustubh R. Nagarkar, Peter Borgesen, Krishnaswami Srihari
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 399-405, November 5–11, 2005
Paper No: IMECE2005-83030
DOI: https://doi.org/10.1115/IMECE2005-83030
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Topics: Damage, Manufacturing, Optical fiber, Fibers, Equipment performance, Adhesives, Lasers, Optical microscopy, Packaging, Photodiodes