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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
DOI: https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Proceedings Papers

AI-Based Reliability Assessment of Power Electronic Systems

F. Patrick McCluskey, Clifton Buxbaum, Sudip K. Mazumder, Arif Sarwat, Matt Ursino, Miles C. Russell
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A015, October 25–27, 2022
Paper No: IPACK2022-97614
DOI: https://doi.org/10.1115/IPACK2022-97614
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Topics: Digital twin, Electronic systems, Reliability
Proceedings Papers

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
DOI: https://doi.org/10.1115/IPACK2021-73367
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Topics: Additive manufacturing, Sintering, Tension-leg platforms, Transients (Dynamics)
Journal Articles

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
DOI: https://doi.org/10.1115/1.4051999
Published Online: September 8, 2021
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Topics: Cooling, Electronics, Flow (Dynamics), Heat, Heat sinks, Manifolds, Manufacturing, Microchannels, Switches, Thermal management
Proceedings Papers

Advanced Packaging and Thermal Management of High-Power DC-DC Converters

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
DOI: https://doi.org/10.1115/IPACK2019-6559
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Topics: Electronics, Packaging, Packaging density (Electronics), Thermal management
Proceedings Papers

Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

Erick Gutierrez, Kevin Lin, Douglas DeVoto, Patrick McCluskey
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A020, October 7–9, 2019
Paper No: IPACK2019-6470
DOI: https://doi.org/10.1115/IPACK2019-6470
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Topics: Gates (Closures), Transistors
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Paper No: IPACK2018-8392
DOI: https://doi.org/10.1115/IPACK2018-8392
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Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Paper No: IPACK2018-8338
DOI: https://doi.org/10.1115/IPACK2018-8338
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Journal Articles

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020903.
Paper No: EP-17-1100
DOI: https://doi.org/10.1115/1.4039265
Published Online: May 9, 2018
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Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Paper No: IPACK2017-74138
DOI: https://doi.org/10.1115/IPACK2017-74138
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Paper No: IPACK2017-74286
DOI: https://doi.org/10.1115/IPACK2017-74286
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
DOI: https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Paper No: IPACK2015-48757
DOI: https://doi.org/10.1115/IPACK2015-48757
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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A037, July 6–9, 2015
Paper No: IPACK2015-48577
DOI: https://doi.org/10.1115/IPACK2015-48577
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Topics: High temperature, Shear strength, Tin, Transients (Dynamics), Creep, Sinter (Metallurgy), Temperature, Sintering, Tension-leg platforms, Copper
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Paper No: IPACK2015-48422
DOI: https://doi.org/10.1115/IPACK2015-48422
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux
Proceedings Papers

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A012, July 6–9, 2015
Paper No: IPACK2015-48496
DOI: https://doi.org/10.1115/IPACK2015-48496
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Topics: Cooling, Electronics, Fluids, Vapors, Heat flux, Pressure drop, Computational fluid dynamics, Engineering simulation, Experimental design, Heat transfer
Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Paper No: IPACK2013-73209
DOI: https://doi.org/10.1115/IPACK2013-73209
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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)
Journal Articles

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Peng Wang, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021001.
Paper No: EP-12-1012
DOI: https://doi.org/10.1115/1.4023215
Published Online: March 28, 2013
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Topics: Cooling, Flow (Dynamics), Fluids, Heat transfer coefficients, Temperature, Vapors, Thermal resistance, Pressure drop, Thermal management
Proceedings Papers

Thermal Performance and Reliability of Large-Area Bonded Interfaces in Power Electronics Packages

Sreekant Narumanchi, Douglas DeVoto, Mark Mihalic, Tim Popp, Patrick McCluskey
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 837-842, November 11–17, 2011
Paper No: IMECE2011-65399
DOI: https://doi.org/10.1115/IMECE2011-65399
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Topics: Electronic packages, Reliability, Copper, Cycles, Heat, Stress, Thermal resistance, Acoustics, Adhesives, Carbon fibers
Proceedings Papers

Performance Degradation of the MEMS Vibratory Gyroscope in Harsh Environments

Chandradip Patel, Patrick McCluskey
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 511-515, November 11–17, 2011
Paper No: IMECE2011-65001
DOI: https://doi.org/10.1115/IMECE2011-65001
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Topics: Microelectromechanical systems, Stress