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P. Malhotra
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Journal Articles

A Technique for High-Speed Microscopic Imaging of Dynamic Failure Events and Its Application to Shear Band Initiation in Polycarbonate

P. Malhotra, S. Niu, V. Srivastava, P. R. Guduru
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. April 2022, 89(4): 041001.
Paper No: JAM-21-1397
https://doi.org/10.1115/1.4053080
Published Online: December 8, 2021
View Article titled, A Technique for High-Speed Microscopic Imaging of Dynamic Failure Events and Its Application to Shear Band Initiation in Polycarbonate
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Topics: Deformation, Fracture (Materials), Imaging, Particulate matter, Resolution (Optics), Shear (Mechanics), Simulation, Displacement, Failure, Constitutive equations
Includes: Supplementary data
Journal Articles

Cardiac Arrest Alert System

M. Schroeder, E. Alvarez, M. Steele, P. Malhotra, M. Mbipeh
Journal: Journal of Medical Devices
Publisher: ASME
Article Type: Design Of Medical Devices Conference Abstracts
J. Med. Devices. June 2009, 3(2): 027532.
https://doi.org/10.1115/1.3147483
Published Online: July 9, 2009
View Article titled, Cardiac Arrest Alert System
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Topics: Cardiology, Emergencies, Medical signal processing, Optics, Risk, Signal processing, Signals
Proceedings Papers

Control of Temperature Uniformity During the Manufacture of Stable Thin-Film Photovoltaic Devices

Chetan P. Malhotra, Roop L. Mahajan, W. S. Sampath, Kurt L. Barth, Robert A. Enzenroth
Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 547-555, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61331
https://doi.org/10.1115/IMECE2004-61331
View Paper titled, Control of Temperature Uniformity During the Manufacture of Stable Thin-Film Photovoltaic Devices
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Topics: Temperature uniformity, Thin films, Radiation (Physics), Cavities, Control systems, Finite element analysis, Glass, Graphite, Heat conduction, Temperature
Proceedings Papers

High Knudsen Number Physical Vapor Deporition: Predicting Deposition Rates and Uniformity

Chetan P. Malhotra, Roop L. Mahajan, W. S. Sampath
Proc. ASME. IMECE2005, Heat Transfer, Part B, 1001-1008, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82329
https://doi.org/10.1115/IMECE2005-82329
View Paper titled, High Knudsen Number Physical Vapor Deporition: Predicting Deposition Rates and Uniformity
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Topics: Cavities, Computational fluid dynamics, Computer software, Finite element analysis, Flow (Dynamics), Knudsen number, Radiation (Physics), Simulation, Thermal radiation, Thin films
Journal Articles

High Knudsen Number Physical Vapor Deposition: Predicting Deposition Rates and Uniformity

Chetan P. Malhotra, Roop L. Mahajan, W. S. Sampath
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 2007, 129(11): 1546–1553.
https://doi.org/10.1115/1.2712855
Published Online: July 21, 2006
View Article titled, High Knudsen Number Physical Vapor Deposition: Predicting Deposition Rates and Uniformity
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Topics: Film thickness, Finite element analysis, Flow (Dynamics), Flux (Metallurgy), Geometry, Knudsen flow, Radiation (Physics), Simulation, Vacuum, Vapor deposition
Journal Articles

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
https://doi.org/10.1115/1.1510864
Published Online: December 12, 2002
View Article titled, An Analytical Cure Model for Underfill Epoxies
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Topics: Epoxy adhesives, Epoxy resins, Hardening (Curing), Heating, Heat transfer coefficients, Temperature
Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Article titled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating