1-7 of 7
Nicolas Lamaison
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Paper No: IPACK2017-74030
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
Published Online: January 5, 2017
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Paper No: IPACK2015-48288
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030908.
Paper No: EP-12-1088
Published Online: July 24, 2013