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Proceedings Papers

Modeling Gait Transitions of Quadruped and Their Generalization With CMAC Neural Networks

Jian-Nan Lin, Shin-Min Song
Proc. ASME. IDETC-CIE2000, Volume 7A: 26th Biennial Mechanisms and Robotics Conference, 681-688, September 10–13, 2000
Publisher: American Society of Mechanical Engineers
Paper No: DETC2000/MECH-14124
https://doi.org/10.1115/DETC2000/MECH-14124
View Paper titled, Modeling Gait Transitions of Quadruped and Their Generalization With CMAC Neural Networks
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Topics: Artificial neural networks, Kinematics, Modeling
Proceedings Papers

Packaging Challenges of Thin High Bandwidth POP

Fletcher (Cheng-Piao) Tung, Jensen (Ying-Chou) Tsai, Yu-Po Wang, Joe (Chih-Nan) Lin, Gary (Yue-Long) Fan
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A014, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11181
https://doi.org/10.1115/IMECE2019-11181
View Paper titled, Packaging Challenges of Thin High Bandwidth POP
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Topics: Manufacturing, Package on package, Packaging, Reliability, Warping
Proceedings Papers

Comparison of Two Ductile Crack Propagation Models of GTN and CZM for Pipe Steel Fracture

Junqiang Wang, Haitao Wang, Nan Lin, Honglian Ma, Jinlong Wang
Proc. ASME. PVP2018, Volume 6A: Materials and Fabrication, V06AT06A004, July 15–20, 2018
Publisher: American Society of Mechanical Engineers
Paper No: PVP2018-84689
https://doi.org/10.1115/PVP2018-84689
View Paper titled, Comparison of Two Ductile Crack Propagation Models of GTN and CZM for Pipe Steel Fracture
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Topics: Ductile fracture, Fracture (Materials), Fracture (Process), Pipes, Steel, Crack propagation, Damage, Shapes, Accuracy and precision, Cohesion
Journal Articles

A Lifetime Prediction Method of Pressured Gas Polyethylene Pipes by Thermal-Oxidative Aging Test and Tensile Test

Yang Wang, Hui-qing Lan, Tao Meng, Shan Chen, Jian-dong Zuo, Nan Lin
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research-Article
J. Pressure Vessel Technol. February 2018, 140(1): 011404.
Paper No: PVT-17-1131
https://doi.org/10.1115/1.4038526
Published Online: December 5, 2017
View Articletitled, A Lifetime Prediction Method of Pressured Gas Polyethylene Pipes by Thermal-Oxidative Aging Test and Tensile Test
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Topics: Polyethylene pipes, Pressure, Temperature, Mechanical properties
Proceedings Papers

Strain Actuation Behavior of Barium Titanate Single Crystal Loaded Electromechanically in Non-Variant [110] Direction

Jay Shieh, Yen-Nan Lin, Yi-Chung Shu
Proc. ASME. SMASIS2012, Volume 2: Mechanics and Behavior of Active Materials; Integrated System Design and Implementation; Bio-Inspired Materials and Systems; Energy Harvesting, 149-153, September 19–21, 2012
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2012-8034
https://doi.org/10.1115/SMASIS2012-8034
View Paper titled, Strain Actuation Behavior of Barium Titanate Single Crystal Loaded Electromechanically in Non-Variant [110] Direction
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Topics: Crystals, Electric fields, Stress, Temperature, Prisms (Optics), Compressive stress, Machining, Switches, Testing
eBook Chapter

A New Chaos Based Image Encryption Algorithm

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
https://doi.org/10.1115/1.859919.paper200
ISBN: 9780791859919
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Topics: Algorithms, Chaos, Encryption
Proceedings Papers

Modeling Gait Transitions Between Two Periodic Gaits for Quadrupeds and Hexapods

Jian-Nan Lin, Shin-Min Song
Proc. ASME. IMECE2003, Dynamic Systems and Control, Volumes 1 and 2, 675-682, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42710
https://doi.org/10.1115/IMECE2003-42710
View Paper titled, Modeling Gait Transitions Between Two Periodic Gaits for Quadrupeds and Hexapods
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Topics: Cycles, Modeling, Robots, Waves
Journal Articles

Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics

Yeau-Ren Jeng, Professor, Jeng-Nan Lin, Graduate Student
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. July 2003, 125(3): 576–581.
https://doi.org/10.1115/1.1537265
Published Online: June 19, 2003
View Articletitled, Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics
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Topics: Bonding, Interface phenomena, Shear (Mechanics), Welding, Wire, Wire bonding, Surface roughness, Integrated circuits, Microelectronic devices